XX线路板表面贴装焊接工艺研究

发布时间：2018-04-05 21:46

本文选题：回流焊　切入点：Ansys　出处：《北华航天工业学院》2017年硕士论文

【摘要】：近年来,随着电子技术的飞速发展,电子产品的集成化程度大大提升。相应的,表面贴装技术SMT(Surface Mount Technology,简称SMT)迅速发展起来。回流焊是SMT特有的核心工艺,也是目前最流行和最常用的批量生产焊接技术,它是一种自动群焊过程,成千上万个焊点的焊接在短短几分钟内一次完成,其焊接质量的优劣直接影响到产品的质量和可靠性。本文对固定型号线路板的表面贴装焊接工艺进行研究,该线路板在焊接中有锡珠产生,并且QPI-5LZ器件虚焊,针对此类焊接不良问题,提出仿真与正交实验相结合的研究方法。仿真借助Ansys Workbench软件,对PCB组件进行仿真分析,观察PCB组件测试点的升温情况以及整体的热分布云图,进而针对传送带速率以及温区的温度设计正交实验,借助KIC温度测试软件,对测试点实际升温数据进行分析,找到影响焊接质量的因素。通过仿真与正交实验,解决了XX线路板焊接缺陷的问题,并对QPI-5LZ器件的焊接情况进行了分析,为类似封装器件的焊接提供了依据。最终达到了优化焊接缺陷,提高焊接质量的目的。
[Abstract]:In recent years, with the rapid development of electronic technology, the degree of integration of electronic products has been greatly improved.Accordingly, surface mount technology, SMT(Surface Mount Technology, has developed rapidly.Reflow welding is the core process of SMT, and it is also the most popular and commonly used mass production welding technology. It is an automatic group welding process. Thousands of solder joints are welded in just a few minutes.The quality of welding directly affects the quality and reliability of products.In this paper, the surface mount welding technology of fixed type circuit board is studied. There are tin beads produced in the welding of the circuit board, and the QPI-5LZ device is virtual welded. Aiming at the problem of this kind of bad welding, the research method of combining simulation and orthogonal experiment is put forward.With the help of Ansys Workbench software, the simulation analysis of the PCB module is carried out, and the temperature rise of the test point of the PCB component and the overall thermal distribution cloud diagram are observed. Then the orthogonal experiment is designed for the conveyer belt rate and the temperature in the temperature zone, and the KIC temperature test software is used to test the temperature.The actual temperature data of test points are analyzed and the factors affecting welding quality are found out.Through simulation and orthogonal experiment, the welding defects of XX circuit board are solved, and the welding condition of QPI-5LZ device is analyzed, which provides the basis for the welding of similar packaging devices.Finally, the purpose of optimizing welding defects and improving welding quality is achieved.
【学位授予单位】：北华航天工业学院
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TN405

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