晶体硅多线锯水基切削液的研究

发布时间：2018-04-14 20:49

本文选题：硅片 + 多线锯切割　；参考：《天津工业大学》2017年硕士论文

【摘要】：硅片是半导体和光伏产业最重要最基础的原材料,近年来随着半导体和光伏产业的快速发展,对硅片加工质量的标准也越来越高。在硅片加工的众多工序中,硅腚的切片是对硅片质量影响最大、消耗成本最高的工序。目前,主流的硅片切割方式是多线锯切割工艺,与传统的内圆切割相比,它具有效率高、切缝损失小、表面损伤层浅、表面质量好、能加工大尺寸硅片的优点。在游离磨料线锯切割法的基础上,固结磨料线锯切割(金刚石线锯切割)法是被研发出来的新一代硅片切割方式,此工艺进一步提高了加工效率,降低生产成本,减少环境污染,提升了硅片的表面质量。在固结磨料线锯切割工艺中,金刚石磨料以特定的方式固定在钢线上,所以水基切削液是在该加工过程中必不可少的辅材。现阶段,国内硅片加工企业使用的金刚石线锯水基切削液大多是来自于国外的进口产品,由于切削液售价较高,造成了硅片切割成本的上涨。本文旨在研制出适用于金刚石线锯切割工艺的水基切削液,并对有关问题进行了理论上的分析。首先,对市售的进口金刚石线锯水基切削液的组分进行剖析,利用染料的颜色变化、沉淀、萃取的方法对进口切削液试样的表面活性剂种类进行鉴定,利用钠熔法对元素进行鉴定;采用蒸馏的方法分离出切削液中溶液,并进行鉴定;再采用薄层色谱与硅胶柱色谱相结合的方法对进口切削液试样的有效组分进行分离,优化得到最佳分离条件并进行制备柱色谱分离,利用有机波普分析法对分离得到的纯净组分离线跟踪,确定进口切削液试样中各组分的分子结构。在参考进口金刚石线锯水基切削液剖析的结果上,结合在硅片切割过程中切削液具有的分散、冷却、清洗、消泡、润湿、防腐蚀等特性,对金刚石线锯水基切削液的配方进行探究。切削液主要成分除以水为溶剂外还包括分散剂、消泡剂、表面活性剂、缓蚀剂、润湿剂、螯合剂等。对复配所得的水基切削液进行性能测试,在工厂中进行试验。试验结果表明,与进口切削液相比,自制切削液在切割过程中未产生明显气泡,对硅粉的分散悬浮能力与进口切削液相当,切割硅片的一次合格率为93.97%,比巴索切削液高1.63%,而且自制切削液切割得到硅片的TTV(总厚度偏差)、WARP(翘曲度)、TV(中心厚度偏差)都要优于进口切削液切割得到的硅片。
[Abstract]:Silicon wafer is the most important and basic raw material in semiconductor and photovoltaic industry. With the rapid development of semiconductor and photovoltaic industry in recent years, the quality standard of silicon wafer processing is becoming higher and higher.Among the many processes of wafer processing, the chip of silicon buttock is the most important and cost consuming process.At present, the mainstream silicon wafer cutting method is multi-wire saw cutting technology. Compared with the traditional inner circle cutting, it has the advantages of high efficiency, low slit loss, shallow surface damage layer, good surface quality and the ability to process large size silicon wafers.On the basis of the free abrasive wire saw cutting method, the consolidation abrasive wire saw cutting (diamond wire saw cutting) method is a new generation silicon chip cutting method developed. This process further improves the processing efficiency and reduces the production cost.Reduce environmental pollution and improve the surface quality of silicon wafer.In the cutting process of consolidated abrasive wire saw, diamond abrasive is fixed on steel wire in a specific way, so water-based cutting fluid is an indispensable auxiliary material in this process.At present, most of the water-based cutting fluids of diamond wire saws used in domestic silicon wafer processing enterprises are imported products from abroad. Because of the high price of cutting fluid, the cost of cutting silicon wafer has increased.The purpose of this paper is to develop a water-based cutting fluid suitable for diamond wire saw cutting process and to analyze the related problems in theory.First of all, the composition of the imported diamond wire saw water-based cutting fluid was analyzed, and the types of surfactants of imported cutting fluid samples were identified by the method of dye color change, precipitation and extraction.The elements were identified by sodium melting method, the solution in cutting fluid was separated by distillation, and the effective components of imported cutting fluid were separated by thin-layer chromatography and silica gel column chromatography.The optimum separation conditions were optimized and chromatographic separation was carried out on the preparation column. The separation lines of the pure group were tracked by organic pop analysis to determine the molecular structure of each component in the sample of imported cutting fluid.Referring to the analysis results of imported diamond wire saw water based cutting fluid, combined with the characteristics of dispersing, cooling, cleaning, defoaming, wetting, anticorrosion and so on in the process of cutting silicon wafer,The formula of water-based cutting fluid for diamond wire saw was studied.Besides water as solvent, the main components of cutting fluid include dispersant, defoamer, surfactant, corrosion inhibitor, wetting agent, chelating agent and so on.The performance of the water-based cutting fluid was tested and tested in the factory.The experimental results show that, compared with the imported cutting fluid, the self-made cutting fluid has no obvious bubble in the cutting process, and its ability of dispersing and suspending silicon powder is equal to that of the imported cutting fluid.The first pass rate of cutting silicon wafer is 93.97, which is 1.63 higher than that of Basso cutting fluid. Moreover, TTV (total thickness deviation) of silicon wafer obtained by self-made cutting fluid is better than that obtained by imported cutting fluid.
【学位授予单位】：天津工业大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TN305

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