高速封装集成技术的EMI风险探究

发布时间：2018-04-21 20:14

本文选题：电磁干扰 + 辐射　；参考：《浙江大学》2017年硕士论文

【摘要】：随着数据传输速率和工作带宽的提升,芯片的封装设计面临着日益严峻的电磁兼容(Electromagnetic Compatibility,EMC)挑战。电磁干扰(Electromagnetic Interference,EMI)作为电磁兼容领域的核心议题,一直是学术界和工业界的研究热点。因此,本文围绕公司商用的芯片封装集成技术,探究了其在高速信号传输下的EMI风险,并进行相应的解决方案研究。本文首先基于引线键合式方形扁平封装(Wire-Bonded Quad Flat Package,WB-QFP)和引线键合式球栅阵列封装(Wire-Bonded Ball Grid Array,WB-BGA),探究了它们在高速信号传输下的EMI风险。文中以美国联邦通讯委员会(Federal Communications Commission,FCC)对无意辐射的电场限值作为主要依据,结合S参数、表面电流分布、电场分布等依据,详细阐述和分析了潜在的风险项。其中,键合线、基板表层介质厚度和基板介电常数是WB-QFP封装在25 GHz内最主要的EMI风险项。封装盖和键合线是WB-BGA封装在25 GHz内最主要的EMI风险项。此外,我们构建了键合线的等效电路,结合全波和电路仿真准确预测了谐振频率。接着,针对WB-BGA封装面临的EMI风险,本文提出了几种切实可行的解决方案,包括基于电磁带隙(ElectromagneticBandgap,EBG)结构的新型封装盖、阻性过孔、阻性封装盖和键合线返回路径。这些技术方案均可以有效抑制宽带高频辐射,尤其是阻性封装盖在3～25 GHz内实现了超过10 dBμV/m的抑制效果。最后,本文结合传统的EMI屏蔽结构和石墨烯独特的电学性能,设计了两款基于石墨烯周期性图案的宽带EMI屏蔽结构,在39.2～200 GHz内实现了 95%的吸收率。文中详细分析了屏蔽结构的参数特性和工作机制。
[Abstract]:With the improvement of data transmission rate and working bandwidth, the packaging design of the chip is facing more and more serious challenges of electromagnetic compatibility (EMC). Electromagnetic interference (EMI), as the core topic of electromagnetic compatibility (EMC), has been a hot research topic in academia and industry. Therefore, in this paper, the EMI risk under high speed signal transmission is explored and the corresponding solutions are studied around the chip packaging and integration technology of the company. Firstly, based on Wire-Bonded Quad Flat package WB-QFP) and lead bonded ball gate array package Wire-Bonded Ball Grid Arrayn WB-BGAA, this paper explores their EMI risks under high speed signal transmission. Based on the electric field limit value of the Federal Communications Commission for unintentional radiation, the potential risk terms are described and analyzed in detail according to the S parameters, surface current distribution, electric field distribution and so on. The bonding line, the thickness of the substrate surface medium and the dielectric constant of the substrate are the most important EMI risk factors for WB-QFP encapsulation in 25 GHz. The capping and bonding lines are the main EMI risk items for WB-BGA encapsulation within 25 GHz. In addition, the equivalent circuit of the bonding line is constructed, and the resonant frequency is accurately predicted by combining the full wave and circuit simulation. Then, in view of the EMI risk of WB-BGA packaging, this paper proposes several feasible solutions, including a new packaging cover based on electromagnetic band-gap (EBA) structure, a resistive through hole, a resistive package cover and a bonding line return path. These technical schemes can effectively suppress broadband high frequency radiation, especially the resistive packaging cover can achieve more than 10 dB 渭 V / m suppression effect in 310dB / 25 GHz. Finally, combined with the traditional EMI shielding structure and the unique electrical properties of graphene, two broad band EMI shielding structures based on graphene periodic pattern are designed. The absorptivity of 95% is achieved in 39.2 GHz. The parameter characteristics and working mechanism of shield structure are analyzed in detail.
【学位授予单位】：浙江大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TN03

【参考文献】