静压液浮大面积电致化学抛光试验台研制

发布时间：2018-04-23 18:04

本文选题：电致化学抛光 + 静压支承　；参考：《大连理工大学》2015年硕士论文

【摘要】：电致化学抛光加工是一种新的表面超精密加工方法,该方法通过电化学氧化将抛光液中的电活性中介体氧化成刻蚀剂,对工件进行刻蚀加工,基于离子扩散来控制反应进程,通过超平滑电极实现工件的抛光加工。该加工方法具有距离敏感性,其加工精度以及材料去除率与加工间隙成反比例关系,为了实现加工区域材料去除的一致性和可控性,必须保证加工间隙液膜厚度即工件表面和电极表面间隙的均一高精度控制。因此,超平滑电极的制备以及工件和电极间加工间隙的高精度控制是实现电致化学抛光的关键技术。针对大面积电极电致化学抛光中工作电极与工件之间均匀微纳间隙的控制要求,提出了基于液体静压支承技术的微纳间隙控制方法,在理论计算的基础上设计并制作了一套基于液体静压支承的微纳间隙控制装置。对所制作的微纳间隙控制装置进行试验标定,可实现0-8μm的调节范围,小于500 nm/kPa的调节分辨率以及±0.2μm的重复定位精度。针对大面积电极电致化学抛光中对电极的要求,设计并制作了直径为50mm的溅射金薄膜和玻碳镶嵌两种不同形式的工作电极,并对两种电极的性能进行了分析。最后,利用所设计的液体静压支承微纳间隙控制装置并结合电化学工作站三电极体系对溅射铜工件进行了电致化学抛光。在工作电极不自转的情况下,取得了较好的抛光和平坦化效果,工件表面粗糙度Ra值从82nm改善至4nm,刻蚀区域的线轮廓PV值从290m降低到120 nm,但加工区域的边缘处散布着一些凸峰。当工作电极加入自转后,与静态电致化学抛光相比,整体面型改善效果不明显,但是铜工件表面的微观凸峰得到了极大改善,工件表面粗糙度Ra值也从216 nm减小到6 nm。
[Abstract]:Electro-chemical polishing is a new ultra-precision surface machining method, which oxidizes the electrically active intermediaries in the polishing liquid to etch agents through electrochemical oxidation, and etching the workpiece. The reaction process is controlled based on ion diffusion. The polishing of workpiece is realized by super smooth electrode. The machining method has the sensitivity of distance, the machining precision and the material removal rate are inversely proportional to the machining clearance. In order to realize the consistency and controllability of the material removal in the processing area, It is necessary to ensure the uniform and high precision control of the thickness of the liquid film between the workpiece surface and the electrode surface. Therefore, the preparation of super-smooth electrode and the high precision control of machining gap between workpiece and electrode are the key technologies to realize electro-chemical polishing. Aiming at the control requirement of uniform micro / nano gap between working electrode and workpiece in large area electrochemical polishing, a method of micro / nano gap control based on hydrostatic support technology is proposed. On the basis of theoretical calculation, a micro-nano gap control device based on hydrostatic support is designed and fabricated. The experimental calibration of the micro / nano gap control device can realize the adjustment range of 0-8 渭 m, adjust resolution of less than 500 nm/kPa and repeat positioning accuracy of 卤0.2 渭 m. In order to meet the requirements of electrode in large area electrochemical polishing, two kinds of working electrodes, sputtering gold thin film with diameter of 50mm and glassy carbon mosaic, were designed and fabricated, and the properties of the two kinds of electrodes were analyzed. Finally, the electro-chemical polishing of the sputtering copper workpiece was carried out by using the designed hydrostatic pressure supporting micro-nano gap control device and the three-electrode system of electrochemical workstation. When the working electrode is not rotating, a better polishing and flattening effect is obtained. The surface roughness Ra value of the workpiece is improved from 82nm to 4 nm, and the line profile PV value of the etching area is reduced from 290 m to 120 nm, but some convex peaks are scattered at the edge of the machining area. When the working electrode is rotated, the effect of surface shape improvement is not obvious compared with static electrochemical polishing, but the micro-convex peak of copper workpiece surface is greatly improved, and the surface roughness Ra value of the workpiece is reduced from 216 nm to 6 nm.
【学位授予单位】：大连理工大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN305.2

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