柔性光电互联电路研究现状

发布时间：2018-04-27 09:22

  本文选题：光电子学 + 光互联　； 参考：《激光与光电子学进展》2016年08期

【摘要】：柔性光电印制电路板(FEOPCB)作为板级光互联的新发展方向,不仅具有光互联的巨大优势,而且还具有柔性电路板的特性,可实现不同子系统间的柔性互联,能够满足高速电子系统轻量化、小型化和高性能化的发展趋势。对国内外柔性光电电路的研究现状进行了详细的阐述与分析,并探讨了该互联电路的关键技术及未来研究方向。
[Abstract]:As a new development direction of board level optical interconnection, flexible optoelectronic printed circuit board (FEEPC B) not only has the great advantages of optical interconnection, but also has the characteristics of flexible circuit board, which can realize flexible interconnection among different subsystems. It can meet the development trend of high speed electronic system such as lightweight, miniaturization and high performance. The research status of flexible optoelectronic circuit at home and abroad is described and analyzed in detail, and the key technology and future research direction of the interconnection circuit are discussed.
【作者单位】： 中国电子科技集团公司第三十研究所;
【分类号】：TN491
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本文编号：1810157