基于智能算法优化PCB板上电子元件热布局的试验研究及数值模拟

发布时间：2018-04-28 23:28

本文选题：热设计 + 电子元件　；参考：《长安大学》2017年硕士论文

【摘要】：随着电动汽车以及电力电子设备技术的飞速发展,电子设备的组成元件正朝着小尺寸、大功率、高集成的方向发展,由此造成电子元件的热流密度逐步上升,当热流密度超过一定的上限时会使电子元件工作时的温度太高而引发热失效问题。印制电路板PCB和电子元件在电子设备中有极为广泛的应用,对其进行热设计和热分析对汽车电器设备的性能提升有重要意义。本文运用模拟退火算法对某一PCB板上若干电子元件的温度布局进行了优化研究。以9个阵列在PCB上电子元件为研究对象,运用有限差分法求解出PCB上电子元件温度的一般方程式,并应用模拟退火算法获得优化前后电子元件的布局。本文随后利用红外成像技术,对上述理论优化结果进行实验验证。实验结果表明:所有不同工况下电子元件的全局最高温度都得到了不同程度的下降,最高降幅8.7%,最低降幅6.5%,证明运用模拟退火算法优化PCB上电子元件热布局方法有明显效果。最后利用三维仿真软件Icepak针对本文研究内容进行仿真研究。首先进行各个工况下优化前后实验结果与仿真结果对比研究,然后再对各个工况优化前后仿真结果对比研究,结果表明:1)各个工况下相同电子元件温度实验值与仿真值的相对偏差小于10%,仿真模型建立合理;2)仿真中所有工况全局电子元件最高温度都有明显不同程度降低,证明优化方法有效;3)数值模拟可以在一定误差条件下取代实验,在工程应用中发挥巨大潜力。
[Abstract]:With the rapid development of electric vehicle and power electronic equipment technology, the components of electronic equipment are developing towards the direction of small size, high power and high integration. When the heat flux exceeds a certain upper limit, the temperature of electronic components will be too high to cause thermal failure. Printed circuit board (PCB) and electronic components are widely used in electronic equipment. Thermal design and thermal analysis are of great significance to improve the performance of automotive electrical equipment. In this paper, simulated annealing algorithm is used to optimize the temperature distribution of some electronic components on a PCB board. The finite difference method is used to solve the general equation of the temperature of electronic elements on PCB with nine arrays on PCB. The simulated annealing algorithm is used to obtain the optimized layout of electronic components. In this paper, infrared imaging technology is used to verify the above theoretical optimization results. The experimental results show that the global maximum temperature of electronic components in all different working conditions has been decreased to varying degrees, the highest drop is 8.7, and the lowest is 6.5. It is proved that the simulated annealing algorithm is effective in optimizing the thermal layout of electronic components on PCB. At last, the three-dimensional simulation software Icepak is used to simulate the content of this paper. First, the comparison between the experimental results and the simulation results before and after the optimization under each working condition is carried out, and then the simulation results before and after the optimization under each working condition are compared. The results show that the relative deviation between the experimental value of the same electronic component and the simulation value is less than 10 under each working condition, and the simulation model is reasonable.) in all the simulation conditions, the maximum temperature of the global electronic component has obviously decreased in varying degrees. It is proved that the optimization method is effective and the numerical simulation can replace the experiment under certain error conditions, thus exerting great potential in engineering application.
【学位授予单位】：长安大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TN41

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