尘土中可溶性盐对电路板绝缘失效的影响

发布时间：2018-04-28 23:40

本文选题：绝缘失效 + 尘土污染　；参考：《电工技术学报》2016年11期

【摘要】：随着电子设备的小型化,印制电路板的导线间距变小,使得导线间电化学迁移失效问题更加突出。同时,大气污染严重,尘土颗粒沉积吸附在电路板上,其中的可溶性盐会改变电路板表面吸附水膜的离子浓度,从而改变线间绝缘失效机理和失效时间。使用浸银Y形电路板,采用不同浓度氯化钠溶液和尘土溶液水滴实验的方法来研究电路板表面存在可溶性盐溶液的情况下导线间绝缘失效特征与失效时间的变化规律。发现随着溶液离子浓度的升高,电路板绝缘失效机理由电化学迁移转变为离子性导电,失效时间呈现先减小后增大再陡降的趋势。存在促进阳极金属快速形成电化学迁移的可溶性盐溶液浓度Ca、由电路板阳极金属离子迁移形成晶枝导电向离子导电为主导转换的盐溶液浓度Cb及直至完全抑制电化学迁移的盐浓度Cc。
[Abstract]:With the miniaturization of electronic equipment, the wire spacing of printed circuit board becomes smaller, which makes the problem of electrochemical migration failure more prominent. At the same time, the air pollution is serious, the dust particles are deposited on the circuit board, the soluble salt will change the ion concentration of the adsorbed water film on the surface of the circuit board, thus changing the failure mechanism and the failure time of the insulation between the lines. In this paper, the characteristics of insulation failure and the variation of failure time between conductors in the presence of soluble salt solution on the surface of the circuit board were studied by using the water drop test method of different concentrations of sodium chloride solution and dust solution in the Y-shaped circuit board. It is found that with the increase of ion concentration in the solution, the electrochemical migration of the insulation failure mechanism of the circuit board changes into ionic conductivity, and the failure time decreases first and then increases sharply. The concentration of soluble salt solution can promote the rapid electrochemical migration of anodic metal, and the concentration of salt solution cb can be transformed from dendritic conduction to ionic conduction from anodic metal ion migration of circuit board to complete inhibition of electricity. The concentration of chemically migrated salt, Cc.
【作者单位】：北京邮电大学自动化学院;
【分类号】：TN41

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