多层介质结构椭圆函数型带通滤波器研究与设计

发布时间：2018-05-01 22:43

本文选题：集总参数 + 带通滤波器　；参考：《南京邮电大学》2017年硕士论文

【摘要】：目前现代微波技术的发展如火如荼,减小滤波器整体体积并且提高传输品质是研究中的根本诉求。多层结构滤波器可以满足滤波器件空间紧凑的目标,由于在搭建物理模型中不可避免的会引入寄生效应,这会直接导致滤波系统性能下降。椭圆函数带通滤波器的物理结构中谐振电容电感元件是成对出现的,这使得它与同类结构相比,性能更加优越。另一方面在搭建物理模型时,可以通过该优越的性能调节元件值大小达到减小寄生效应使系统S参数曲线性能更加优越的目标。本论文的主要研究对象是椭圆函数带通滤波器,研究步骤是设计物理电路模型,并分析电路中各个元件值与S参数曲线的映射关系,最后对符合设计指标的三维模型结构进行加工测试。论文的主要工作和创新点如下:(1)分析了传统的多层介质结构元件。重点研究了三维结构电容性能的优劣处,并且设计出了一种改进型三维结构电容。利用软件对其仿真,发现改进型结构在自谐振频率变大的同时品质因数也增高,说明在相同用料面积下可以获得更多等效电容值并且内部损耗小。该改进型电容结构完全符合多层结构空间利用率高的设计要求。(2)以物理电路模型为出发点,采用印制电路板技术设计,实物加工出符合设计标准的三维物理结构。结构共有八层并内置改进型电容,模型系统空间利用率高。此外利用打孔技术即并联电感降低整体结构中的寄生效应,非常巧妙地解决了仿真结果右侧陷波不明显的问题。实物测量结果和软件仿真结果非常接近,说明该设计符合最初的指标要求并具有良好的性能。(3)利用物理电路系统谐振单元中元件值的变化对整体滤波器性能影响的结论设计了一款多层低温共烧陶瓷结构带通滤波器模型。电路建模讨论分析低温共烧陶瓷结构模型中寄生通带存在位置和原因并重新规划元件摆放位置以消除寄生通带。最终设计出一款九层低温共烧陶瓷结构物理模型,整体结构体积小,空间利用率高,利用HFSS仿真可以发现其仿真性能优越,基本符合设计初衷。
[Abstract]:At present, the development of modern microwave technology is in full swing, reducing the overall size of the filter and improving the transmission quality is the fundamental demand in the research. The multilayer filter can meet the goal of compact filter space. The parasitic effect will inevitably be introduced into the physical model, which will directly lead to the degradation of filter system performance. In the physical structure of the elliptic function bandpass filter, the resonant capacitor inductance element appears in pairs, which makes it superior to the similar structure. On the other hand, when the physical model is built, the superior value of the component can be adjusted to reduce the parasitic effect and make the performance of the S parameter curve more superior. The main research object of this paper is elliptic function band-pass filter. The research step is to design the physical circuit model and analyze the mapping relationship between each component value and S parameter curve in the circuit. Finally, the machining test of three-dimensional model structure according to the design index is carried out. The main work and innovation of this paper are as follows: 1) analyze the traditional multilayer dielectric elements. The merits and demerits of the three-dimensional structure capacitance are studied and an improved three-dimensional structure capacitor is designed. It is found that the improved structure has higher self-resonant frequency and higher quality factor, which indicates that more equivalent capacitance values can be obtained under the same feed area and the internal loss is small. The improved capacitance structure fully meets the design requirements of high space utilization ratio of multilayer structure. (2) based on the physical circuit model, the printed circuit board technology is used to design the 3D physical structure which conforms to the design standard. The structure has eight layers and an improved capacitance, so the model system has a high space utilization rate. In addition the parallel inductor is used to reduce the parasitic effect in the whole structure which solves the problem that the right notch is not obvious in the simulation results. The result of physical measurement is very close to the result of software simulation. It shows that the design meets the initial requirements and has good performance. (3) A multi-layer low temperature co-fired ceramic structure is designed using the conclusion that the change of element value in the resonant unit of the physical circuit system affects the performance of the whole filter. Band-pass filter model. The location and reason of parasitic passband in the low temperature co-fired ceramic structure model are discussed and analyzed, and the location of the elements is rearranged to eliminate the parasitic passband. Finally, a nine-layer low temperature co-fired ceramic structure physical model is designed. The whole structure is small and the space utilization ratio is high. Using HFSS simulation, it can be found that its simulation performance is superior, which basically accords with the original design intention.
【学位授予单位】：南京邮电大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TN713.5

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