聚合物平板微器件复合成型工艺研究及测试

发布时间：2018-05-08 17:33

本文选题：注塑成型 + 平板微制件　；参考：《大连理工大学》2015年硕士论文

【摘要】：聚合物平板微器件在生命科学和光学领域有广泛用途。如微流控芯片、导光板等。由于微注塑成型具有成型周期短、自动化程度高等优点,已经成为微流控芯片最主要的加工方法之一。用户对聚合物平板微器件有整形的新需求。除此之外,注塑成型后对于有些平板微器件存在的平面度过大可能会影响后续器件封装键合及使用,本文针对上述需求和问题,以一种聚合物平板微器件-微流控芯片为对象,在对注塑工艺进行优化的基础上,研究聚合物平板微器件的二次整形方法,成果适用于聚合物平板微器件的中小批量制造领域。主要研究内容包括以下几个方面：研制了一套包含浇注机构、模温控制系统和顶出机构的微注塑模具,其中微镶件采用模具钢为材料,利用微铣削和微细电火花技术加工出多尺度、变截面的微结构,微镶件采用双螺纹结构安装在定模架上。在此基础上,选择最佳注塑工艺参数,制得微沟道填充率接近1、平面度约为27.111μm的平板微制件。提出了一种基于视觉对准的铣削整形方法,采用非接触对刀方式对注塑成型制件外轮廓进行二次铣削整形,整形指标为外轮廓中心平面相对于微沟道中心平面的对称度,铣削整形后制件外轮廓中心平面相对于微沟道中心平面的对称度控制在0.4mm内,满足实际使用要求。理论研究了热压温度和压力的耦合场对铣削整形器件的平面变形的影响,对铣削整形的器件进行热压整平实验,采用干涉法测量器件平面度和器件部分区域的不平度,实验结果表明：器件平面度由热压整平前的27.111μm降低至4.341μm,器件部分区域不平度由热压整平前的16.471 μm/mm降低至3.430μm/mm,可有效改善器件的平面变形。采用紫外胶连等方法,将加工的微器件组成微流控芯片,并搭建了芯片流量测试实验装置,对芯片进行流量测试和疲劳测试。实验结果表明：采用提出方法制造的微流控芯片,芯片使用60小时未发生漏液现象,流量线性回归方程的R2为0.837。
[Abstract]:Polymer flat-plate microdevices are widely used in life sciences and optics. Such as microfluidic chip, light guide plate and so on. Microinjection molding has become one of the most important processing methods for microfluidic chips because of its advantages of short forming cycle and high automation. Users have a new demand for polymer flat-plate microdevices. In addition, after injection molding, it may affect the packaging bonding and use of some flat plate microdevices after injection molding. In view of the above requirements and problems, this paper takes a polymer flat plate microdevice-microfluidic chip as an object. Based on the optimization of injection molding process, the secondary shaping method of polymer flat microdevices is studied. The results are applicable to the field of medium and small batch manufacturing of polymer flat microdevices. The main research contents include the following aspects: a set of micro-injection moulds including pouring mechanism, mold temperature control system and ejection mechanism are developed, in which the micro-inserts are made of die steel. The multi-scale and variable cross-section microstructures were fabricated by using micro-milling and micro-EDM technology. The micro-inserts were installed on the die frame with double-thread structure. On the basis of this, the best injection molding process parameters are selected, and the micro-groove filling ratio is close to 1, and the planeness is about 27.111 渭 m. A new milling and shaping method based on visual alignment is proposed, in which the external contour of injection molding parts is second milling and shaping by non-contact cutter. The shaping index is the symmetry degree of the center plane of the outer contour relative to the center plane of the micro-channel. The symmetry between the center plane of the outer contour and the center plane of the micro-channel after milling and shaping is controlled in 0.4mm to meet the practical requirements. The effect of the coupling field of hot pressing temperature and pressure on the plane deformation of milling and shaping device is studied theoretically. The flatness of the device and the unevenness of part of the device are measured by interferometry. The experimental results show that the planeness of the device is reduced from 27.111 渭 m to 4.341 渭 m before hot pressing, and the unevenness of part of the device is reduced from 16.471 渭 m/mm to 3.430 渭 m / mm, which can effectively improve the plane deformation of the device. The microfluidic chip was made up of the fabricated microdevices by means of ultraviolet glue connection, and a flow test device was built to test the flow rate and fatigue of the chip. The experimental results show that the microfluidic chip fabricated by the proposed method has no leakage for 60 hours, and the R2 of the linear flow regression equation is 0.837.
【学位授予单位】：大连理工大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TQ320.662;TN492

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