半导体封装行业制造执行系统的研究与应用

发布时间：2018-05-10 08:08

本文选题：晶圆 + 半导体封装　；参考：《东南大学》2015年硕士论文

【摘要】：半导体技术给人们的日常生活和学习带来了目新月异的变化,电脑、手机等高科技电子产品都离不开半导体技术的发展。在半导体技术中,半导体的制造是比较常见而且广泛的制造行业。半导体的制造分为前道和后道,前段主要以沙石形态的单晶硅为原材料,生产出晶圆。后道主要对晶圆进行切割,然后通过封装、测试,制造出各种芯片。用于各个电子行业的微处理单元。本文研究的重点是半导体封装制造业MES系统的设计与实现,结合南通某微电子股份有限公司的集成、高效、先进、实用企业管理需求,完成半导体封装制造执行系统的开发及相关技术的应用与研究,对于以后进一步研究和开发适用于半导体封装行业规范集成的制造执行系统的推广和改进有较大的借鉴意义。第一部分首先分析课题的研究意义,并给出制造执行系统的概念、功能模型以及制造执行系统在国内外的发展趋势,使读者对制造执行系统有个大概的了解。鉴于半导体封装制造行业的特殊性,着重介绍了半导体后道封装行业及其发展趋势,并阐述后道封装的主要工艺流程,结合当前企业的生产业务模式,给出MES系统具体的需求。第二部分着重介绍了系统的设计。结合行业特性讨论了半导体MES系统的软硬件架构的设计、MES系统集成接口设计原理以及数据库设计。基于目标企业的需求,将整个系统划分为6大模块,重点阐述WIP模块的功能设计及业务流程研究。第三部分重点阐述半导体封装MES系统三层架构的实现,分别从中间通信层、服务端、客户端三个方面阐述WIP在制品管理模块功能的实现。通过友好的操作界面,使读者对软件的主要功能和工作原理有一定的深入了解。第四部分对MES系统进行测试验证,证明了系统的工程应用价值所在。最后,对本系统设计和实现进行总结,并且对未来的发展走向进行阐述。在更多的工业领域加以应用。本课题设计的制造执行系统已开发完成,目前已在企业中运行实施,大大提高了半导体封装制造的生产效率。
[Abstract]:Semiconductor technology brings new changes to people's daily life and study. Computer, mobile phone and other high-tech electronic products can not be separated from the development of semiconductor technology. Semiconductor manufacturing is a common and extensive manufacturing industry in semiconductor technology. The fabrication of semiconductors is divided into front channel and back channel. In the front section, single crystal silicon is used as raw material to produce wafers. After cutting the wafer, packaging, testing, fabrication of various chips. Micro processing units used in various electronic industries. This paper focuses on the design and implementation of MES system in semiconductor packaging manufacturing industry, combining with the integration, high efficiency, advanced and practical management requirements of a certain microelectronics company in Nantong. The development of semiconductor packaging manufacturing execution system and the application and research of related technology are of great significance for the further research and development of manufacturing execution system which is suitable for the standardization and integration of semiconductor packaging industry. The first part analyzes the significance of the research, and gives the concept of manufacturing execution system, function model and the development trend of manufacturing execution system at home and abroad, so that readers have a general understanding of manufacturing execution system. In view of the particularity of semiconductor packaging manufacturing industry, this paper mainly introduces the semiconductor back-channel packaging industry and its development trend, and expounds the main technological process of the back-pass packaging. Combined with the current production business model of the enterprise, the specific requirements of the MES system are given. The second part focuses on the design of the system. This paper discusses the design of hardware and software architecture of semiconductor MES system and the design principle of integrated interface of mes system and database design. Based on the requirements of the target enterprise, the whole system is divided into six modules, and the function design and business process research of the WIP module are emphasized. The third part focuses on the realization of the three-layer architecture of semiconductor packaging MES system. The realization of the function of WIP WIP management module is described from three aspects: intermediate communication layer, server and client. Through friendly interface, readers have a deep understanding of the main functions and working principles of the software. In the fourth part, the MES system is tested and verified, and the engineering application value of the system is proved. Finally, the design and implementation of the system are summarized, and the future development trend is described. Be applied in more industrial fields. The manufacturing execution system designed in this paper has been developed and implemented in enterprises, which greatly improves the production efficiency of semiconductor packaging manufacturing.
【学位授予单位】：东南大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN305

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