第一键合点铜线焊接的延时结球与三步键合技术研究

发布时间：2018-05-18 08:50

本文选题：铜线键合 + 延时结球　；参考：《苏州大学》2015年硕士论文

【摘要】：研究背景有三:铜线和金线相比具有良好的电性能、机械性能和价格优势;传统键合的故障率占比为1/4到1/3;产线曾出现第一键合点铜球焊接失效的典型问题。作者负责制程的铜线键合工艺,以22μm铜线为例,统计发现存在着参数不稳定、虚焊、铜球氧化和焊球拉提等具体问题,通过比较产线数据记录、分析焊点失效和调研键合文献,重点分析了三个工艺参数,分别是结球时间、超声能量和劈刀压力,通过扫参配比,具体实践了延迟结球和三步键合的工艺技巧,此举已将良率稳定提升至相对满意的水平。系列改良结果使得公司的产能增长了近1/5。本技术解决方案,因细化了工艺窗口,或可成为推动相关产线优化键合关键参数的技术参考。
[Abstract]:There are three research background: copper wire has good electrical performance, mechanical property and price advantage compared with gold wire; the failure rate of traditional bonding is 1 / 4 to 1 / 3; the production line has the typical problem of the first bond point copper ball welding failure. The author is responsible for the copper wire bonding process. Taking 22 渭 m copper wire as an example, it is found that there are some specific problems such as parameter instability, virtual welding, copper ball oxidation and solder ball pulling. By comparing the production line data records, the paper analyzes the failure of solder joint and the investigation and bonding literature. Three technological parameters, namely, the time of ball junction, ultrasonic energy and chopper pressure, are emphatically analyzed. The process techniques of delayed balling and three-step bonding are concretely practiced through the sweep ratio, which has steadily promoted the yield to a relatively satisfactory level. A series of improvements led to a nearly one-fifth increase in the company's capacity. The technical solution, because of the refinement of the process window, may be a technical reference to promote the optimization of key parameters of production line bonding.
【学位授予单位】：苏州大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN405

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