半导体制造中嵌套性工艺参数的统计过程控制研究

发布时间：2018-05-18 22:35

本文选题：嵌套 + 嵌套控制图　；参考：《西安电子科技大学》2015年硕士论文

【摘要】：在半导体制造领域,随着技术的发展,工艺过程和设备的日益复杂,电子元器件产品自身功能的不断完善,以及顾客不断升级的消费需求和与日俱增的质量期望,促使企业全力加强质量管理,持续保障和提高产品质量。推广先进质量管理方法,实施统计过程控制,确保产品研制与生产过程的稳定受控,正是保证产品质量的重要手段。本论文针对半导体生产过程中晶圆批加工或单片晶圆加工中工艺参数存在嵌套性,常规统计过程控制图不再适用的问题,以理论分析及matlab模拟仿真为手段,研究了嵌套性工艺参数的统计过程控制,完善了现有一阶嵌套控制图并开发了二阶控制图。本文的研究成果有助于提高半导体晶圆批加工或单片晶圆加工的产品质量,减少质量缺陷,对提高企业的市场竞争力具有深远的意义。本论文的主要研究内容包括:1)分析了半导体制造中,晶圆批加工或单片晶圆生产中工艺参数嵌套性产生的原因,并提出嵌套性检验的方法,即方差分析(ANOVA),为工艺参数是否存在嵌套性提出了科学依据。提出了嵌套性检验的步骤,并实例说明了具体的操作过程。2)介绍了一阶嵌套模型,指出有关一阶嵌套控制图的某些文献中的一个常见错误,即将均值方差σ_(xbar)~2与均值期望值方差σ_(between)~2混为一谈,针对这一错误进行了仿真,最终明确了二者的区别,进而指出其得到的一阶嵌套控制图是错误的。3)比较了现有一阶嵌套控制图中计算均值标准偏差σ_(xbar)的三种方法,选出了其中最优的计算方法。从而完善了一阶嵌套均值控制图。并根据常规控制图的组成,提出一阶嵌套控制图由两个控制图组成,并给出了各个控制图控制限的计算方法。4)介绍了二阶嵌套模型,并对二阶嵌套模型进行了仿真验证。5)针对二阶嵌套问题开发了二阶嵌套控制图,确定了二阶嵌套控制图由四个控制图组成。根据SPC技术的基本原理,通过理论推导和仿真,提出了各个控制图控制限的计算方法。该控制图不仅可以用于统计过程控制,还具有诊断功能,可以为失控后的工艺调整提供指导意见。6)为了更好的将本文研究的内容应用于实践,开发了新的质量控制软件工具。该软件可自行判断数据是否存在嵌套性,如存在嵌套性是一阶嵌套还是二阶嵌套,并自动选择相应的控制图,降低了操作人员的学习成本;该软件同时还具有生成SPC报告的功能,为撰写SPC报告节省了时间。
[Abstract]:In the field of semiconductor manufacturing, with the development of technology, the increasingly complex process and equipment, the continuous improvement of the function of electronic components, and the increasing consumer demand and increasing quality expectations of customers, Urges the enterprise to strengthen the quality management, continuously guarantees and improves the product quality. Popularizing advanced quality management methods, implementing statistical process control, and ensuring the stability and control of product development and production process is an important means to ensure product quality. In this paper, aiming at the nesting of process parameters in wafer batch processing or monolithic wafer processing, the conventional statistical process control chart is no longer applicable, which is based on theoretical analysis and matlab simulation. The statistical process control of nesting process parameters is studied. The first order nested control chart is improved and the second order control chart is developed. The research results in this paper are helpful to improve the product quality of semiconductor wafer batch processing or monolithic wafer processing, reduce the quality defects, and improve the market competitiveness of enterprises. The main research contents of this thesis include: (1) the reason of nesting process parameters in semiconductor manufacturing is analyzed, and the nesting test method is put forward. Analysis of variance (ANOVA) provides a scientific basis for nesting process parameters. The first order nesting model is introduced, and a common error in some literatures about the first order nesting control diagram is pointed out. In this paper, we confuse the mean variance (蟽) and the mean expected value (蟽) and make a simulation of this error, and finally make clear the difference between the two. Furthermore, it is pointed out that the first order nested control graph is wrong. 3) the three methods of calculating mean standard deviation 蟽 class deviation in the first order nested control chart are compared, and the optimal calculation method is selected. Thus the first order nested mean control graph is improved. According to the composition of conventional control chart, the first order nested control chart is composed of two control charts, and the calculation method of control limit of each control chart is given. (4) the second order nested model is introduced. The second order nested control chart is developed for the second order nesting problem, and the second order nested control chart is made up of four control charts. According to the basic principle of SPC technology, through theoretical derivation and simulation, the calculation method of control limit of each control chart is put forward. The control chart not only can be used in statistical process control, but also has diagnostic function. It can provide guidance for process adjustment after runaway. 6) in order to better apply the contents of this paper to practice, a new quality control software tool is developed. The software can judge whether the data is nested or not, such as whether the nesting is first order or second order nesting, and automatically select the corresponding control chart, which reduces the learning cost of operators. The software also has the function of generating SPC report, which saves time for writing SPC report.
【学位授予单位】：西安电子科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN305

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