声表面波器件微制造技术研究

发布时间：2018-05-21 03:19

  本文选题：微纳制造 + 键合　； 参考：《西安工业大学》2015年硕士论文

【摘要】：近年来,随着MEMS技术和半导体技术的进步,电子器件正向着高集成度、低功耗和高速度方面发展。声表面波器件(Surface acoustic wave,SAW)所使用的材料对器件的性能起着决定性的作用,本文对器件的材料石英和LiNbO3分别和Si进行了键合技术研究,为了制作器件对键合片进行了减薄抛光,设计了简单的器件并用COMSOL和MATLAB对器件的性能进行了仿真、后续研究了器件的光刻技术。从本文的研究内容得到以下结论：①通过选择一定波段的紫外固化胶,并在300-436nm曝光波长的曝光机下曝光,制得了8mm×8mm键合片。分别实现了LiNbO3以及石英和硅片的键合,用剪切力测试机测得最大键剪切力分别为116.2N和117.9N。用裂纹传播测试法测试LiNbO3键合片的键合能为5.831 J/m2。键合片的中间键合层厚度为约3μm。②在声表面波器件的设计中,根据δ函数模型的理论分析结合本实验对叉指换能器的参数进行了设计,设计出线宽2.495μm的延迟器和线宽2μm的谐振器,后根据设计的结果用L-edit画出版图,制得本实验所需要的掩膜板。③用有限元仿真软件COMSOL对设计的器件进行建立模型,分析了器件的波传播特性。在MATLAB上以LiNbO3为基底,用P矩阵和COM耦合模型对声表面波谐振器电学谐振特性的插入损耗和谐振导纳进行了仿真研究。④用设计制得的掩膜板做掩膜,在制得的键合片上经过涂胶、前烘、曝光、显影四个部分制得了光刻形貌较好的样品。经过试验得到前烘100℃(10min),曝光时间7.5s,显影时间40s用显微镜观察到最好的光刻效果,光刻线宽为2.495μm。前烘100℃(10min),曝光时间8s,显影时间40s得到线宽为2μm的最好光刻图案。
[Abstract]:In recent years, with the development of MEMS technology and semiconductor technology, electronic devices are developing towards high integration, low power consumption and high speed. The materials used in the surface acoustic wave device (saw) play a decisive role in the performance of the device. In this paper, the bonding technology of quartz and LiNbO3 and Si are studied respectively. In order to make the device, the bonding plate is thinned and polished. A simple device is designed and the performance of the device is simulated by COMSOL and MATLAB. The photolithography technology of the device is studied. From the study of this paper, the following conclusions are drawn: 1. By selecting a certain band of UV curable adhesive and exposed under the exposure machine of 300-436nm exposure wavelength, the 8mm 脳 8mm bonding plate is prepared. The bonding of LiNbO3 and quartz and silicon wafer is realized respectively. The maximum bond shear force measured by shear force tester is 116.2N and 117.9Nrespectively. The bonding energy of LiNbO3 bonding plate measured by crack propagation method is 5.831 J / m2. The thickness of the intermediate bonding layer of the bonding plate is about 3 渭 m ~ 2. In the design of saw devices, the parameters of the interDigital transducer are designed according to the theoretical analysis of the 未 function model and this experiment. The delay device of 2.495 渭 m line width and the resonator of 2 渭 m line width are designed. According to the design results, the layout of the device is drawn with L-edit, and the mask plate 3 required in this experiment is built up by the finite element simulation software COMSOL. The wave propagation characteristics of the device are analyzed. The insertion loss and resonant admittance of surface acoustic wave resonator are simulated by using P matrix and COM coupling model based on LiNbO3 on MATLAB. 4. The mask plate designed is used as mask. The samples with better lithography were prepared by coating, pre-baking, exposure and development on the prepared bonding sheet. The best lithography effect was observed by microscope for 40 s, exposure time was 7.5 s. The line width of lithography was 2.495 渭 m. The best lithography pattern with a linewidth of 2 渭 m was obtained by baking at 100 鈩，

本文编号：1917510