高出光效率透明基板的LED封装

发布时间：2018-05-21 07:35

本文选题：透明基板封装 + LED灯丝　；参考：《杭州电子科技大学》2015年硕士论文

【摘要】：本文以透明基板为封装材料,设计并实现了一种新型的LED灯丝球泡灯,以提高LED的出光效率为主要目的,对LED芯片封装技术的发展现状和存在的一些问题进行了较为深入的阐述;通过理论分析、仿真模拟与实践相结合的方法,探索了LED最佳光色性能和散热性能的封装结构和材料的工艺参数;制作并测试透明基板封装的LED灯丝球泡灯的相关性能。分析以及测试结果表明:(1)对小功率LED芯片而言,选用热导率为20W/(m?K)氧化铝陶瓷基板,热导率为10~64W/(m?K)导热胶即可满足其封装要求。散热基板厚度为0.2mm厚时,增大固晶层厚度可在一定程度上减小LED芯片温度,一般情况下,为避免固晶胶爬胶、浸没LED芯片等引起电极短路问题的发生,固晶层厚度应小于LED芯片厚度。(2)LED基板厚度增大,LED芯片正常工作的温度越低,适当减小LED封装基板材料的厚度,可避免LED器件的蓝光泄露、眩光,且节约成本,故选取LED基板厚度为0.2mm。(3)研制了一种新型高出光效率的透明基板封装的LED灯丝球泡灯。根据ANSYS仿真,对LED芯片封装工艺做了全面且细致的设计,而后采用丝网印刷技术制备了封装线路板、接着对LED芯片固晶和引线焊接、荧光粉胶的调配、荧光胶的涂覆,最后制成了正装芯片和倒装芯片封装在不同基板材料上的几种高出光效率的透明基板封装的LED灯丝球泡灯。(4)测试所制的高出光效率的透明基板封装的LED灯丝的光色电性能、老化性能、红外热像图以及铂热电阻,LED灯丝球泡灯(采用正装/倒装芯片的玻璃封装)光通量467.29lm/230.802 lm、光效110.06lm/W/118.36 lm/W;相关色温3172K/3158 K、显色指数84.1/82.7、色纯度34.9%/37.4%。LED灯丝球泡灯(采用正装/倒装芯片的蓝宝石封装)光通量471.69lm/231.375 lm、光效111.79lm/W/120.07 lm/W;相关色温3004K/3048 K、显色指数81.9/83.5、色纯度47%/42.2%。(5)对现有的LED球泡灯做了光学对比测试与分析,采用透明基板封装的LED灯丝球泡灯比现有封装LED的亮度提升了16%,发光效率提高了13%,显色指数提高了4%。采用透明基板封装的LED灯丝结构紧凑、体积小、重量轻、成本低、高光效,代替了人们使用了100多年的钨丝白炽灯,符合人们的审美观。
[Abstract]:In this paper, a new type of LED filament bulb lamp is designed and realized with transparent substrate as the packaging material. The main purpose of this paper is to improve the efficiency of LED. The development of LED chip packaging technology and some existing problems are described in depth, and the method of combining simulation with practice, through theoretical analysis, simulation and practice, is presented. The optimum photochromic and heat dissipation properties of LED packaging structure and material process parameters were explored, and the properties of LED filament bulb lamp with transparent substrate packaging were tested and fabricated. The analysis and test results show that for the low power LED chip, the thermal conductivity of 20 W / m ~ (-1) Al _ 2O _ 3 ceramic substrate with a thermal conductivity of 10 ~ 64 W / m ~ (-1) can meet the packaging requirements. When the thickness of the heat dissipation substrate is 0.2mm, the temperature of the LED chip can be reduced to some extent by increasing the thickness of the solid layer. In general, in order to avoid the short circuit of the electrode caused by the gluing of the solids and the immersion of the LED chip, The thickness of solid layer should be smaller than the thickness of LED chip. The thicker the substrate thickness of LED chip is, the lower the temperature of normal operation of LED chip is. It can avoid the leakage of blue light, glare and save cost by decreasing the thickness of LED packaging substrate material. Therefore, a new type of LED filament bulb lamp with high light efficiency and transparent substrate encapsulation is developed by selecting 0.2mm 路m3 LED substrate thickness. According to ANSYS simulation, the encapsulation process of LED chip is designed in detail, and then the packaging circuit board is fabricated by screen printing technology. Then, the solid crystal and lead welding of LED chip, the blending of phosphor glue and the coating of fluorescent glue are carried out. Finally, several kinds of LED filament bulb lamp with high light efficiency and transparent substrate encapsulated on different substrate materials are fabricated to test the photochromic properties of the LED filament with high light efficiency and transparent substrate encapsulation. Aging performance, Infrared thermogram and platinum thermal resistor LED filament bulb lamp (glass package with positive / inverted chip) luminous flux 467.29lm/230.802 lm, light efficiency 110.06lm/W/118.36 LM / W; related color temperature 3172K/3158 K, color index 84.1 / 82.7, color purity 34.9%/37.4%.LED filament bulb lamp (using formal / inverted chip) The luminous flux 471.69lm/231.375 lm, light efficiency 111.79lm/W/120.07 LM / W; related color temperature 3004K/3048 K, color rendering index 81.9 / 83.5, color purity 47 / 42.2) were compared and analyzed for the existing LED bulb lamps. The brightness of the LED filament bulb lamp packaged with transparent substrate is increased by 16 times than that of the existing package LED, the luminous efficiency is increased by 13 times, and the color rendering index is increased by 4%. The LED filament packaged with transparent substrate has compact structure, small volume, light weight, low cost and high light efficiency. It replaces the tungsten filament incandescent lamp which has been used for more than 100 years.
【学位授予单位】：杭州电子科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN312.8

【共引文献】