微纳连接技术研究进展

发布时间：2018-05-31 22:21

本文选题：电子封装 + 微连接　；参考：《材料科学与工艺》2017年05期

【摘要】：近年来,集成电路不断向短小轻薄的高集成方向发展,推动着器件封装尺寸不断缩小,也使器件封装结构发生着改变.同时,作为信息革命的重要组成部分,集成电路技术往往涉及到多个领域的交叉和相互渗透,如微机电系统、精密仪表以及柔性器件等,而作为电子元器件封装中的关键技术,微纳连接技术的发展直接关系到电子工业中新型封装结构的研发与技术革新.因此,集成电路中微纳连接技术的发展也与多个技术领域密切相关.本文针对电子组装中微连接技术进行归纳和总结,并阐述纳米连接技术所取得的最新研究进展.通过总结微纳连接技术在不同互联尺度下的研究与应用现状,明确了微纳连接技术在电子工业领域中的重要作用,也为目前和未来的相关研究工作提供参考方向.
[Abstract]:In recent years, the integrated circuit has been developing to the direction of short, lightweight and high integration, which promotes the device packaging size to shrink, and also makes the device packaging structure change. At the same time, as an important part of the information revolution, the integrated circuit technology often involves the intersection and mutual penetration of many fields, such as MEMS, precision instruments and flexible devices, and as the key technology in the packaging of electronic components. The development of micro-nano connection technology is directly related to the research and development of new packaging structure and technological innovation in electronic industry. Therefore, the development of micro-and nano-connection technology in integrated circuits is closely related to many technical fields. In this paper, the micro-connection technology in electronic assembly is summarized, and the latest research progress of nano-bonding technology is described. By summarizing the research and application status of micro-nano connection technology in different interconnected scales, the important role of micro-nano connection technology in electronic industry is clarified, and it also provides reference for current and future research work.
【作者单位】：先进焊接与连接国家重点实验室(哈尔滨工业大学);
【基金】：国家优秀青年基金项目(51522503)
【分类号】：TN405

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