集成电路封装引线框产品分层的解决方案研究

发布时间：2018-06-04 17:34

本文选题：分层 + （裸芯）　；参考：《苏州大学》2015年硕士论文

【摘要】：进入集成电路封装领域，分层是一个常见的故障现象。相对于基板产品，引线框产品的分层发生率更高。它将带来电性能和可靠性降低的问题，比如爆米花现象。本文目标有二：一是开列影响分层的因子，提供改善分层的方向。二是基于较多的实际案例，，归纳总结其改善方案。具体论文内容举要有五： 1.概论封装制程和失效分析方法； 2.聚类分层的影响因子； 3.分析改善分层的方法； 4.改善方法的验证； 5.总结归纳各改善方法。研究结果提示：改善分层最常用技巧，依性价比降幂排列为：电浆清洗，减小镀银区，表面粗化，芯片位置优化，以及，模压参数优化。上述方案能够解决85%以上的分层问题，而当这些改善方案不能奏效时，还可通过优化树脂或优化封装体结构来达到改善效果。研究结论认为：本封装优化设计的案例，权可作为深刻理解基尔必法则的实战精华。
[Abstract]:In the field of integrated circuit packaging, layering is a common fault phenomenon. Compared with substrate products, lead frame products have a higher incidence of delamination. It will lead to problems of reduced electrical performance and reliability, such as popcorn. The objectives of this paper are twofold: The first is to list the factors that affect the stratification and provide the direction of improving the stratification. Second, based on more practical cases, summarized its improvement plan. There are five main contents of the thesis: 1. Introduction to packaging process and failure analysis method; 2. The influencing factors of clustering and stratification; 3. The methods of improving stratification are analyzed. 4. Improve the validation of the method; 5. Summarize and summarize each improvement method. The results show that the most commonly used techniques to improve layering are as follows: plasma cleaning, reduction of silver plating area, surface coarsening, chip location optimization, and molding parameters optimization according to the ratio of performance to price. The above scheme can solve more than 85% of the problem of stratification, and when these improvement schemes can not work, we can also optimize the resin or the structure of the package to achieve the improvement effect. The conclusion is that the case of this package optimization design can be used as the essence of understanding Kierbi rule.
【学位授予单位】：苏州大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN405

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