硅微通道结构释放及后整形技术研究

发布时间：2018-06-10 11:22

本文选题：硅微通道 + 结构释放　；参考：《长春理工大学》2017年硕士论文

【摘要】：结构释放技术与整形技术为硅微通道制备过程中的两个重要工艺环节。本论文主要研究结构释放技术及之后的通道整形技术。从湿法腐蚀结构释放实验现象中发现了硅微通道阵列背部塌陷问题。通过观察实验中的表面形貌变化,得出背部塌陷现象是由腐蚀不均引起的。并且其形貌与晶向存在一定关系。对化学机械抛光法结构释放之后的硅微通道阵列厚度误差进行分析,改进了实验步骤。对温度以及腐蚀液浓度进行调整,从而有效的控制整形之后通道的形貌。通过对异丙醇浓度的控制,缩短了整形实验所需要的时间,从大致的5小时缩短为3小时。并且分析了整形实验后硅微通道的尺寸。
[Abstract]:Structural release technology and shaping technology are two important processes in the fabrication of silicon microchannels. In this thesis, the structure release technique and the subsequent channel shaping technique are studied. The problem of back collapse of silicon microchannel array was found from the experimental phenomenon of wet corrosion structure release. By observing the surface morphology in the experiment, it is concluded that the back collapse is caused by uneven corrosion. And its morphology and crystal direction are related to a certain extent. The thickness error of silicon microchannel array released by chemical-mechanical polishing method was analyzed and the experimental steps were improved. The temperature and the concentration of corrosion solution were adjusted to effectively control the morphology of the channel after shaping. By controlling the concentration of isopropanol, the time needed for plastic experiment was shortened from about 5 hours to 3 hours. The size of silicon microchannel after shaping experiment was analyzed.
【学位授予单位】：长春理工大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TN303

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