高集成硅基微波光子芯片的研究进展及趋势

发布时间：2018-07-03 07:31

本文选题：微波光子集成 + 硅基光子　；参考：《光通信研究》2017年03期

【摘要】：随着微波光子技术的发展,在解决传统射频领域无法直接实现的功能方面已经有了很大的成就,同时大大促进了光电子通信技术的发展。然而,微波光子技术仍面临着新的挑战:现有的光通信系统由分立的光/电、电/光等元器件构成,在不断追求更高速率、更大带宽和更强处理能力的通信系统的现状下,要求器件和系统的尺寸更小、功耗更低及抗干扰能力更强。因此,通过硅基集成技术和微波光子技术的结合实现微波光子学系统芯片集成化,从而降低整个系统的成本、缩小尺寸、降低功耗,是微波光子学发展的必然趋势。文章总结了微波光子集成技术和硅基光子器件的发展现状,指出可调谐、可编程的硅基微波光子芯片必将成为军事领域和民用方面发展的关键技术。
[Abstract]:With the development of microwave photonic technology, great achievements have been made in solving the functions that can not be realized directly in the traditional RF field, and the development of optoelectronic communication technology has been greatly promoted. However, microwave photonic technology still faces new challenges: existing optical communication systems are composed of discrete optical / electrical, electrical / optical components, and are constantly pursuing higher rates, wider bandwidth and stronger processing power. The device and system are required to be smaller in size, lower in power consumption and stronger in anti-jamming capability. Therefore, it is the inevitable trend of microwave photonics to realize the integration of microwave photonics system chip through the combination of silicon-based integrated technology and microwave photonic technology, thus reducing the cost, size and power consumption of the whole system. This paper summarizes the development of microwave photonic integration technology and silicon based photonic devices, and points out that the tunable and programmable silicon based microwave photonic chips will become the key technologies in the military and civil fields.
【作者单位】：北京邮电大学电子工程学院;武汉电信器件有限公司;
【基金】：国家“八六三”计划资助项目(2015AA016901)
【分类号】：TN491

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