SMT细密间距元件锡膏印刷研究

发布时间：2018-07-14 17:40

【摘要】：本文主要探讨SMT(Surface Mount Technology,表面贴装技术)细密间距元件锡膏印刷的应用技术,主要内容关于01005矩形片式元件锡膏印刷的设计方法和解决方案。文章简单介绍了表面贴装技术发展历程,表面贴装技术基本流程。逐一阐述SMT流程中使用到的设备,材料和工具,并且详尽描述其工作原理,控制要点以及特性。在此可以让读者对SMT加工技术有一个清晰的总体概览,这样也有利于理解本文涉及的诸多设计方法和实验技术。对于SMT细密间距元件锡膏印刷研究顺序,笔者首先从目前SMT业界所涉及的最小包装尺寸元件——01005矩形片式元件焊盘设计开始,结合焊盘上面不同涂层处理方式,综合研究二者对SMT细密间距元件锡膏印刷的影响。同时,由于SMT各加工流程之间紧密的相互关系,笔者也通过使用切片,推力测试等技术手段来确认焊接后产品最终质量。在这个测试环节中,笔者优化的焊盘和钢网设计方案表现出显著效果。同时,测试也证明了OSP焊盘对锡膏印刷大有帮助。这种优化设计和OSP焊盘处理方式,适合在SMT细密间距锡膏印刷工艺技术中推广。文章通过讨论SMT锡膏印刷另一大影响要素——钢网,探讨不同材料和表面处理的钢网对锡膏印刷及质量的影响。通过同等条件下横向比较四种不同钢网,证明了纳米涂层钢网的优点:更有利于锡膏转移率。SMT细密间距元件锡膏印刷解决方案中,纳米涂层钢网属于值得推荐的技术应用。最后一个应用技术研究还是着眼于钢网,笔者提出一种新颖的阶梯钢网设计方案,这种方案可以解决使用同一块钢网加工时,在满足01005矩形片式元件锡膏印刷质量同时,又能保证其它大尺寸电子元器件对锡膏量的需求。测试证明,这种技术可以直接应用在SMT大小不同电子元器件混合装配工艺中。
[Abstract]:This paper mainly discusses the application technology of SMT (Surface Mount Technology) finely spaced element tin paste printing. The main content is about the design method and solution of 01005 rectangular sheet element tin paste printing. This paper briefly introduces the development of surface mount technology and the basic process of surface mount technology. The equipment, materials and tools used in the SMT process are described one by one, and its working principle, control points and characteristics are described in detail. In this paper, readers can have a clear overview of SMT processing technology, which is also helpful to understand the many design methods and experimental techniques involved in this paper. For the research sequence of SMT finely spaced element tin paste printing, the author begins with the minimum package size element 01005 rectangular sheet element pad design, which is involved in the SMT industry at present, and combines the different coating treatment methods on the pad. The effect of the two factors on the printing of SMT fine spacing element tin paste was studied. At the same time, due to the close relationship between the processing processes of SMT, the author also uses slicing, thrust testing and other technical means to confirm the final quality of the welded products. In this test link, the author's optimized design scheme of pad and steel mesh shows remarkable effect. At the same time, the test also proves that OSP solder pad is very helpful for solder paste printing. This optimization design and OSP pad treatment are suitable for SMT fine spacing tin paste printing technology. In this paper, the influence of different materials and surface treatment on the printing and quality of tin paste is discussed by discussing another important factor of SMT tin paste printing: steel mesh. By comparing four different kinds of steel mesh under the same conditions, it is proved that the advantages of nanocrystalline coated steel net are: it is more favorable to the solder paste printing solution of the SMT fine spacing element, and the nano-coated steel net belongs to the recommended technical application. The last applied technology research is focused on steel mesh. The author puts forward a new design scheme of step steel mesh, which can solve the problem that the printing quality of 01005 rectangular sheet element tin paste can be satisfied when the same steel mesh is used. It can also guarantee the requirement of tin paste for other large-sized electronic components. The test results show that this technique can be directly applied to the mixed assembly process of electronic components with different SMT sizes.
【学位授予单位】：苏州大学
【学位级别】：硕士
【学位授予年份】：2016
【分类号】：TN41

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