无透镜数字全息显微成像技术与应用
发布时间：2018-07-20 18:36
【摘要】：针对微结构和微光学元件等微小物体的表面定量检测,本文介绍了一种利用无透镜数字全息的快速、无损的显微成像方法。首先介绍了基于球面波的无透镜数字全息显微成像技术的基本原理,采用CCD作为光电转换器件,基于迈克尔逊干涉光路,设计了无透镜数字全息显微成像系统,利用反射镜构成折反式光路,系统结构简单、紧凑,提升了系统便携性。然后利用USAF1951分辨率板对构建的成像系统进行了标定实验,得出其横向分辨率为6.69μm,放大倍率为3.375,系统工作距离为12.0mm。此外,还对晶圆表面结构进行实际测量。实验验证了该系统的可行性和有效性,有望进一步应用于MEMS、微光学元件、光学元件等表面形貌的定量测量中。
[Abstract]:In this paper, a fast and lossless microscopic imaging method based on lensless digital holography is introduced for the surface quantitative detection of micro objects such as microstructures and micro optical elements. Firstly, the basic principle of lensless digital holographic microscopic imaging technology based on spherical wave is introduced. A lensless digital holographic microscopic imaging system is designed based on Michelson interference light path and CCD as photoelectric conversion device. The system structure is simple and compact, and the system portability is improved. Then the calibration experiment of the imaging system was carried out using USAF1951 resolution board. The transverse resolution was 6.69 渭 m, the magnification was 3.375, and the operating distance of the system was 12.0mm. In addition, the surface structure of the wafer was measured. The experimental results show that the system is feasible and effective, and it is expected to be used in the quantitative measurement of surface morphology of MEMS, microoptical elements and optical elements.
【作者单位】： 北京理工大学光电学院光机电联合研究中心;北京理工大学深圳研究院;
【基金】：教育部重点实验室2016开放基金(2016OEIOF05) 深圳市科技创新项目资助
【分类号】：TN26
[Abstract]:In this paper, a fast and lossless microscopic imaging method based on lensless digital holography is introduced for the surface quantitative detection of micro objects such as microstructures and micro optical elements. Firstly, the basic principle of lensless digital holographic microscopic imaging technology based on spherical wave is introduced. A lensless digital holographic microscopic imaging system is designed based on Michelson interference light path and CCD as photoelectric conversion device. The system structure is simple and compact, and the system portability is improved. Then the calibration experiment of the imaging system was carried out using USAF1951 resolution board. The transverse resolution was 6.69 渭 m, the magnification was 3.375, and the operating distance of the system was 12.0mm. In addition, the surface structure of the wafer was measured. The experimental results show that the system is feasible and effective, and it is expected to be used in the quantitative measurement of surface morphology of MEMS, microoptical elements and optical elements.
【作者单位】： 北京理工大学光电学院光机电联合研究中心;北京理工大学深圳研究院;
【基金】：教育部重点实验室2016开放基金(2016OEIOF05) 深圳市科技创新项目资助
【分类号】：TN26
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