无铅焊料压入应变率敏感性及PBGA焊点热疲劳可靠性研究
发布时间：2018-08-20 08:34
【摘要】：电子产品的无铅化和微型化使得作为微电子互连材料的无铅焊料尺寸越来越小（微米级），从细观角度对其相关力学性能进行研究有着重要的现实意义。本文基于纳米压入法对三种常用无铅焊料（Sn-3.0Ag-0.5Cu、Sn-0.7Cu及Sn-3.5Ag）的力学性能进行测试，，并对其应变率敏感性予以分析；采用热机械分析仪对三者的热膨胀性能进行测试，同时基于数值模拟分析了焊点间距对PBGA封装热疲劳可靠性的影响，相关研究内容及结论如下： （1）采用纳米压入应变率控制法（P P=C）对三种无铅焊料（Sn-3.0Ag-0.5Cu，Sn-0.7Cu、Sn-3.5Ag）不同应变率下的相关力学性能进行测试。结果表明，无铅焊料的接触刚度随压入深度线性增加，硬度和蠕变变形呈现出明显的应变率敏感性，而弹性模量和蠕变应变速率敏感指数则对应变率不敏感；对比分析三种无铅焊料的力学性能，为封装中无铅焊料的选取提供数据参考。 （2）采用RJY-1P型热机械分析仪对三种无铅焊料的热膨胀性能进行测试，结果发现温度对无铅焊料热膨胀系数的影响不明显，同时熔点较高的焊料其热膨胀系数较低。基于ANSYS有限元分析软件建立PBGA封装简化模型，采用Anand粘塑性本构关系表征Sn-3.0Ag-0.5Cu无铅焊料的力学性能，经数值模拟对比分析了不同焊点间距下PBGA封装的热疲劳可靠性；结果发现焊点间距为1.27mm时PBGA封装的热疲劳寿命相对较高，但整体上焊点间距对封装疲劳寿命的影响规律性不大，模拟所得相关结论对封装工业设计具有一定的指导意义。
[Abstract]:The lead-free solder size of microelectronic interconnection materials is becoming smaller and smaller due to the lead-free and miniaturization of electronic products. It is of great practical significance to study the mechanical properties of lead-free solders from a meso perspective. The mechanical properties of three kinds of lead-free solders (Sn-3.0 Ag-0.5CuSn-0.7Cu and Sn-3.5Ag) were tested based on nano-indentation method, and their strain rate sensitivity was analyzed. At the same time, the effect of solder joint spacing on thermal fatigue reliability of PBGA packaging is analyzed based on numerical simulation. The related research contents and conclusions are as follows: (1) the mechanical properties of three lead-free solders (Sn-3.0 Ag-0.5CuSn-0.7CuSn-3.5Ag) at different strain rates were measured by the strain rate control method. The results show that the contact stiffness of lead-free solder increases linearly with the depth of indentation, hardness and creep deformation show obvious strain rate sensitivity, while elastic modulus and creep strain rate sensitivity index are not sensitive to strain rate. The mechanical properties of three lead-free solders are compared and analyzed to provide a data reference for the selection of lead-free solders in package. (2) the thermal expansion properties of three lead-free solders are tested by RJY-1P thermomechanical analyzer. The results show that the influence of temperature on the thermal expansion coefficient of lead-free solder is not obvious, and the thermal expansion coefficient of the solder with higher melting point is lower. Based on the ANSYS finite element analysis software, the simplified model of PBGA package is established, and the mechanical properties of Sn-3.0Ag-0.5Cu lead-free solder are characterized by Anand viscoplastic constitutive relation. The thermal fatigue reliability of PBGA package with different solder joint spacing is compared and analyzed by numerical simulation. The results show that the thermal fatigue life of PBGA packaging is relatively high when the solder joint spacing is 1.27mm, but the effect of solder joint spacing on the package fatigue life is not so regular as a whole. The simulation results have some guiding significance for packaging industry design.
【学位授予单位】：太原理工大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN405
本文编号：2193029
[Abstract]:The lead-free solder size of microelectronic interconnection materials is becoming smaller and smaller due to the lead-free and miniaturization of electronic products. It is of great practical significance to study the mechanical properties of lead-free solders from a meso perspective. The mechanical properties of three kinds of lead-free solders (Sn-3.0 Ag-0.5CuSn-0.7Cu and Sn-3.5Ag) were tested based on nano-indentation method, and their strain rate sensitivity was analyzed. At the same time, the effect of solder joint spacing on thermal fatigue reliability of PBGA packaging is analyzed based on numerical simulation. The related research contents and conclusions are as follows: (1) the mechanical properties of three lead-free solders (Sn-3.0 Ag-0.5CuSn-0.7CuSn-3.5Ag) at different strain rates were measured by the strain rate control method. The results show that the contact stiffness of lead-free solder increases linearly with the depth of indentation, hardness and creep deformation show obvious strain rate sensitivity, while elastic modulus and creep strain rate sensitivity index are not sensitive to strain rate. The mechanical properties of three lead-free solders are compared and analyzed to provide a data reference for the selection of lead-free solders in package. (2) the thermal expansion properties of three lead-free solders are tested by RJY-1P thermomechanical analyzer. The results show that the influence of temperature on the thermal expansion coefficient of lead-free solder is not obvious, and the thermal expansion coefficient of the solder with higher melting point is lower. Based on the ANSYS finite element analysis software, the simplified model of PBGA package is established, and the mechanical properties of Sn-3.0Ag-0.5Cu lead-free solder are characterized by Anand viscoplastic constitutive relation. The thermal fatigue reliability of PBGA package with different solder joint spacing is compared and analyzed by numerical simulation. The results show that the thermal fatigue life of PBGA packaging is relatively high when the solder joint spacing is 1.27mm, but the effect of solder joint spacing on the package fatigue life is not so regular as a whole. The simulation results have some guiding significance for packaging industry design.
【学位授予单位】：太原理工大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN405
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