高压FSRD少子寿命控制方法的研究
[Abstract]:With the rapid development of high-frequency power electronics technology, the performance of the main switch devices (such as IGBT,GTO and IGCT) is constantly improved, and the recurrent diodes used with them are required to have excellent electrical performance and high reliability. At present, the performance improvement of high voltage fast soft recovery diode (FSRD) is mainly realized by structure optimization and carrier life control, in which life control technology has an important impact on its characteristics and reliability. In this paper, the influence of the type of recombination centers and the lifetime of minority carriers on the characteristics of the devices induced by high and low energy electron irradiation is analyzed. Secondly, the defect distribution caused by high and low energy electron irradiation and H irradiation in silicon was analyzed by CASINO and SRIM program. Finally, the characteristics of high voltage fast soft recovery diode and the resistance to dynamic avalanche were analyzed by ISE simulation software. The main contents of this paper are as follows: first, the requirements of the characteristics of high voltage FSRD on the lifetime of minority carriers are briefly described, and the defect energy level parameters produced by different irradiation methods are analyzed. The effects of the optimum position of the defect level and the minority carrier lifetime on the characteristics of the device are analyzed. Secondly, the defect distribution of high and low energy electron irradiation in silicon is analyzed by using CASINO software, and the device structure and physical model parameters used in simulation are determined. Then, based on the ISE-TCAD software platform, the irradiation model of high voltage FSRD is established, and the high voltage FSRD radiation model is studied. The effect of defect distribution induced by low energy electron irradiation on the characteristics of high pressure FSRD. Thirdly, the defect distribution formed by H irradiation in silicon is analyzed by SRIM program, and then the defect distribution formed by electron irradiation combined with H irradiation is introduced into high voltage diodes through the irradiation model in ISE-TCAD software. The effects of different defect distributions on the characteristics of high voltage diodes are studied. Fourthly, the characteristics of FSRD under different irradiation conditions are compared, and the effects of different irradiation methods on the anti-dynamic avalanche and anti-surge current characteristics of the devices are analyzed. The research results in this paper can provide some reference for the design and development of high-voltage FSRD.
【学位授予单位】:西安理工大学
【学位级别】:硕士
【学位授予年份】:2017
【分类号】:TN31
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