光源封装对直下式背光模组设计的影响
发布时间：2018-08-28 13:17
【摘要】：大尺寸直下式LED背光电视已成为目前液晶电视的主流。但是,随着背光模组尺寸的增大,传统侧面注入式背光源的导光板已经不能满足整个模组的要求,因此,采用轻便、低成本的大尺寸直下式LED背光源方案成为发展趋势。该方案中背光透镜对LED光源的光线发散处理,可以减小光源与目标面的距离,由此减小了背光模组的厚度。具有特定目标光斑的背光透镜设计不仅与透镜材料参数相关,更与LED光源器件的特性相关。它们一起决定了背光模组的亮度、均匀性、对比度等核心参数性能。LED光源器件的特性不仅与芯片相关,也与封装密切相关。目前,LED封装技术快速发展,陆续出现了多种尺寸小、光效高、封装工艺简单的新型“芯片级封装”LED器件,如CSP、PFC、Po D等。这类LED器件能否作为新一代背光源非常值得探讨。本文提出了使用新型封装LED作为背光源的构想,以CSP、PFC为例,从发光角度、尺寸、亮度、光色空间均匀度以及光源散热等多个方面进行分析,并与使用3528封装结构LED器件的传统背光源进行了对比。分析结果从一定程度上验证了将“芯片级封装”LED器件作为背光源的可行性。本文的主要内容分为以下几个部分:1.简要概述了背光技术的发展趋势与LED作为背光源的优势、LED封装技术的发展现状、本论文研究的目的和意义。2.介绍了LED直下式背光模组的组成结构,阐述了LED的发光原理以及实现白光LED的三种方法,并对LED光度学、色度学以及热学方面进行了分析。详细介绍了“芯片级封装”LED器件。3.研究光源封装对背光源热学性能的影响。利用Ansys热学模拟软件分别对传统背3528 LED光源和新型“芯片级封装”LED进行了热学仿真,对比三种光源器件的散热性能,得出了“芯片级封装”器件在热学性能方面优势明显的结论。4.研究光源封装对背光模组光学性能的影响。对传统背光源3528 LED和新型“芯片级封装”LED进行近场光学测试,利用Light-tools光学仿真软件,模拟了三种光源在背光透镜作用下在混光距离为15mm、25mm时在目标面上得到的照度分布,对比分析结果表明“芯片级封装”LED在条件相同时更容易得到面积大且照度均匀的光斑。5.研究光源封装对背光模组光色分布均匀性的影响。利用带有频谱颜色信息的光源文件对3528 LED和新型“芯片级封装”LED进行仿真,模拟加入背光透镜后在混光距离为15mm时目标面上的光色分布均匀程度,分析传统背光源与新型“芯片级封装”LED背光源对背光模组光色分布均匀性的影响。6.理论结合实际进行分析对比,通过实际验证模拟结果,表明“芯片级封装”LED可以应用于背光源领域,并具有诱人的优势。
[Abstract]:Large-size straight-down LED backlight TV has become the mainstream of LCD TV. However, with the increase of the size of backlight module, the light guide plate of the traditional side injection backlight source can not meet the requirements of the whole module. Therefore, it is a trend to adopt a light, low cost, large size straight down LED backlight source scheme. In this scheme, the backlight lens can reduce the distance between the light source and the target surface and reduce the thickness of the backlight module. The design of backlight lens with specific target spot is not only related to the lens material parameters, but also to the characteristics of LED light source device. Together, they determine the brightness, uniformity, contrast and other core parameters of the backlight module. The characteristics of LED light source devices are not only related to the chip, but also closely related to the packaging. At present, with the rapid development of LED packaging technology, there are many new "chip level packaging" LED devices, such as CSP,PFC,Po D, which are small in size, high in light efficiency and simple in packaging process. It is worth discussing whether this kind of LED device can be used as a new generation backlight source. In this paper, the idea of using new encapsulated LED as backlight source is put forward. Taking CSP,PFC as an example, this paper analyzes the luminous angle, dimension, brightness, uniformity of light color space and heat dissipation of light source. And compared with the traditional backlight which uses 3528 package structure LED device. The analysis results verify the feasibility of "chip level encapsulation" LED device as backlight to some extent. The main content of this paper is divided into the following parts: 1. The development trend of backlight technology and the current situation of LED packaging technology as backlight source are briefly summarized. The purpose and significance of this paper. This paper introduces the composition and structure of LED backlight module, expounds the principle of LED luminescence and three methods to realize white light LED, and analyses LED photometry, chromaticity and thermodynamics. The chip level package LED device. 3. 3. The effect of light source packaging on thermal performance of backlight was studied. The thermal simulation of traditional back 3528 LED light source and new "chip level encapsulation" LED is carried out by using Ansys thermal simulation software, and the heat dissipation performance of the three light source devices is compared. The conclusion that "chip level package" device has obvious advantage in thermal performance. 4. The effect of light source packaging on optical performance of backlight module was studied. The near-field optical test of traditional backlight 3528 LED and new "chip level encapsulation" LED is carried out. Using Light-tools optical simulation software, the illumination distribution of three kinds of light sources on the target surface under the action of backlight lens is simulated when the light mixing distance is 15mm to 25mm. The results of comparison and analysis show that "chip level packaging" LED is easier to obtain large area and uniform illumination spot. The effect of light source encapsulation on the light color distribution uniformity of backlight module was studied. The 3528 LED and the new "chip level encapsulation" LED are simulated by using the light source file with spectral color information. The uniformity of the light color distribution on the target surface is simulated when the backlight lens is added to the backlight lens when the mixing distance is 15mm. The influence of traditional backlight source and new "chip level package" LED backlight source on the photochromatic distribution uniformity of backlight module is analyzed. The simulation results show that "chip level packaging" LED can be used in backlight field and has an attractive advantage.
【学位授予单位】：深圳大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN312.8
本文编号：2209498
[Abstract]:Large-size straight-down LED backlight TV has become the mainstream of LCD TV. However, with the increase of the size of backlight module, the light guide plate of the traditional side injection backlight source can not meet the requirements of the whole module. Therefore, it is a trend to adopt a light, low cost, large size straight down LED backlight source scheme. In this scheme, the backlight lens can reduce the distance between the light source and the target surface and reduce the thickness of the backlight module. The design of backlight lens with specific target spot is not only related to the lens material parameters, but also to the characteristics of LED light source device. Together, they determine the brightness, uniformity, contrast and other core parameters of the backlight module. The characteristics of LED light source devices are not only related to the chip, but also closely related to the packaging. At present, with the rapid development of LED packaging technology, there are many new "chip level packaging" LED devices, such as CSP,PFC,Po D, which are small in size, high in light efficiency and simple in packaging process. It is worth discussing whether this kind of LED device can be used as a new generation backlight source. In this paper, the idea of using new encapsulated LED as backlight source is put forward. Taking CSP,PFC as an example, this paper analyzes the luminous angle, dimension, brightness, uniformity of light color space and heat dissipation of light source. And compared with the traditional backlight which uses 3528 package structure LED device. The analysis results verify the feasibility of "chip level encapsulation" LED device as backlight to some extent. The main content of this paper is divided into the following parts: 1. The development trend of backlight technology and the current situation of LED packaging technology as backlight source are briefly summarized. The purpose and significance of this paper. This paper introduces the composition and structure of LED backlight module, expounds the principle of LED luminescence and three methods to realize white light LED, and analyses LED photometry, chromaticity and thermodynamics. The chip level package LED device. 3. 3. The effect of light source packaging on thermal performance of backlight was studied. The thermal simulation of traditional back 3528 LED light source and new "chip level encapsulation" LED is carried out by using Ansys thermal simulation software, and the heat dissipation performance of the three light source devices is compared. The conclusion that "chip level package" device has obvious advantage in thermal performance. 4. The effect of light source packaging on optical performance of backlight module was studied. The near-field optical test of traditional backlight 3528 LED and new "chip level encapsulation" LED is carried out. Using Light-tools optical simulation software, the illumination distribution of three kinds of light sources on the target surface under the action of backlight lens is simulated when the light mixing distance is 15mm to 25mm. The results of comparison and analysis show that "chip level packaging" LED is easier to obtain large area and uniform illumination spot. The effect of light source encapsulation on the light color distribution uniformity of backlight module was studied. The 3528 LED and the new "chip level encapsulation" LED are simulated by using the light source file with spectral color information. The uniformity of the light color distribution on the target surface is simulated when the backlight lens is added to the backlight lens when the mixing distance is 15mm. The influence of traditional backlight source and new "chip level package" LED backlight source on the photochromatic distribution uniformity of backlight module is analyzed. The simulation results show that "chip level packaging" LED can be used in backlight field and has an attractive advantage.
【学位授予单位】：深圳大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN312.8
【参考文献】
相关期刊论文 前8条
1 屠大维;吴仍茂;杨恒亮;赵其杰;黄志华;;LED封装光学结构对光强分布的影响[J];光学精密工程;2008年05期
2 孙智慧;常军;赵楠;金伟其;王涌天;;一种新的用于直下式LCD背光源的LED[J];光学技术;2007年S1期
3 范红忠;曹民;李抒智;杨卫桥;钱晶;;光源近场测量在LED光学设计中的应用与研究[J];光学学报;2012年12期
4 李杨;董素素;王艺燃;王凤超;邹军;;垂直结构LED和倒装结构LED的发光特性研究[J];光电技术应用;2014年05期
5 万睿;李志敏;张凤阳;张晶;黄凡;;一种改善全彩LED显示屏色差影响的方法[J];灯与照明;2007年03期
6 李秀真;郭金龙;杨东升;;一种高亮背光组件的设计开发[J];现代显示;2012年02期
7 宁磊;史永胜;史耀华;陈阳阳;;LED封装结构对出光率的影响[J];液晶与显示;2010年06期
8 钱雯磊;黄健;;LED白光光源近场光色度测量在光学设计中的应用研究[J];中国照明电器;2014年11期
相关会议论文 前1条
1 赵建平;王书晓;;LED照明产品白光定义及其光色一致性研究[A];2013年中国照明论坛——LED照明产品设计、应用与创新论坛论文集[C];2013年
相关硕士学位论文 前1条
1 刘一农;大功率LED及其灯具的光学研究[D];华中科技大学;2013年
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