基于黏弹性的IC塑封过程耦合变形的机理研究
发布时间：2018-08-28 15:53
【摘要】：在IC芯片封装成型过程中,由于封装熔体充填流动与IC芯片的热流固耦合作用使IC芯片产生耦合变形,这会严重影响IC芯片的性能。然而,如何准确预测和精密控制IC芯片的热流固耦合变形至今仍是IC芯片封装成型亟待解决的工程技术难题。国际上现有的基于纯黏性牛顿流体的热流固耦合变形预测理论难以准确描述IC芯片的热流固耦合变形形成机理,为此研究建立真实描述黏弹性熔体与IC芯片的黏弹性热流固耦合效应产生的变形的形成机理理论模型对于预测和精密控制IC芯片的热流固耦合变形显得尤为重要。而至今这一科学问题仍未得到解决,为此本文开展了这一科学问题的理论研究,并以此研究建立了IC芯片的黏弹性热流固耦合变形形成过程的虚拟仿真技术。本文构建了黏弹性热流固耦合变形与黏弹性流变性能参数和过程工艺参数的关联理论,揭示了黏弹性热流固耦合变形形成机理,使IC封塑成型工艺与模具的设计做到“有章可循”,为实现IC封塑成型加工从“摸索制造”到以科学求质量、以技术保成功的“全流程综合控制的工业化科学制造”的飞跃转变奠定了科学的理论基础。黏弹性和纯黏性熔体IC封塑成型过程的对比分析研究结果表明黏弹性熔体和IC芯片热流固耦合效应与纯黏性熔体和IC芯片热流固耦合效应有着本质的差异,研究黏弹性熔体与IC芯片的热流固耦合作用机制,探讨IC芯片在黏弹性熔体与IC芯片热流固耦合压力场、温度场和应力场的多场协同作用下的变形机制是准确预测IC芯片热流固耦合变形和研发IC芯片热流固耦合变形精密控形技术的理论前提。本文基于PTT黏弹性本构模型,研究建立了准确描述IC封塑成型过程中黏弹性熔体充填流动与IC芯片固体热流固耦合效应及其IC芯片黏弹性热流固多场耦合作用变形理论模型,并以此研究建立了IC芯片的黏弹性热流固耦合变形形成过程的虚拟仿真技术,为揭示聚合物黏弹性熔体填充环境下IC芯片的变形机制提供了理论支撑。研究建立了黏弹性热流固耦合变形与黏弹性流变性能参数和过程工艺参数的关联理论,IC芯片的热流固耦合变形随填充熔体参考黏度、黏度比、注射速度的增大而增大,而随熔体松弛时间和模壁温度的增大而减小。研究发现聚合物熔体的黏弹特性对IC芯片热流固耦合变形形成的本质影响是减小了IC芯片上下表面的热流固耦合压力差和黏弹性熔体的流动正应力对IC芯片形成了弹性支撑约束作用,从而导致黏弹性熔体充填流动诱发的IC芯片热流固耦合变形明显小于纯黏性牛顿熔体充填流动诱发的IC芯片热流固耦合变形。研究发现黏弹性熔体与IC芯片热流固耦合变形的主控参数是IC芯片上下表面的热流固耦合压力差,黏弹性熔体与IC芯片共轭耦合传热诱发的不均匀温度场对IC芯片热流固耦合变形起促进作用,其促进作用随着熔体充填流动时间增大而增强,而黏弹性熔体的流动正应力场对IC芯片热流固耦合变形起抑制作用,其抑制作用随着熔体充填流动时间增大而减弱。
[Abstract]:In the process of IC chip packaging, the coupling deformation between the filling flow of package melt and the thermal-fluid-structure interaction of IC chip will seriously affect the performance of IC chip. It is difficult to accurately describe the formation mechanism of Thermal-Fluid-solid coupling deformation of IC chips based on the existing theory of Thermo-Fluid-Solid coupling deformation prediction based on pure viscous Newtonian fluids. Therefore, a theoretical model is established to describe the formation mechanism of Thermal-Fluid-solid coupling deformation of viscoelastic melts and IC chips. It is very important to control the Thermal-Fluid-solid coupling deformation of IC chips. However, this scientific problem has not been solved yet. Therefore, the theoretical study of this scientific problem is carried out in this paper, and the virtual simulation technology of the viscoelastic Thermal-Fluid-solid coupling deformation process of IC chips is established. The theory of correlation between deformation and viscoelastic rheological parameters and process parameters reveals the forming mechanism of viscoelastic Thermo-Fluid-Solid coupling deformation, which makes the design of IC molding process and die "rule-based", and realizes the "whole process synthesis" of IC molding process from "exploring manufacturing" to "seeking quality scientifically" to ensure the success of technology. The theoretical basis for the leap forward transformation of "integrated control of industrial scientific manufacturing" has been laid. The results of comparative analysis of viscoelastic and pure viscous melt IC molding process show that there is essential difference between viscoelastic melt and IC chip Thermo-Fluid-Solid coupling effect and pure viscoelastic melt and IC chip Thermo-Fluid-Solid coupling effect. The mechanism of thermo-fluid-structure interaction between IC chip and IC chip is discussed. The deformation mechanism of IC chip under the interaction of viscoelastic melt and IC chip's Thermo-Fluid-Solid coupling pressure field, temperature field and stress field is the theoretical premise of accurately predicting the Thermo-Fluid-Solid coupling deformation of IC chip and developing the precise Thermo-Fluid-Solid coupling deformation control technology of IC chip. Based on the PTT viscoelastic constitutive model, a theoretical model for accurately describing the Thermal-Fluid-solid coupling effect of viscoelastic melt filling flow and IC chip and the viscoelastic-thermo-fluid-solid multi-field coupling deformation of IC chip was established, and a virtual model for the formation of viscoelastic-thermo-fluid-solid coupling deformation of IC chip was established. The simulation technology provides theoretical support for revealing the deformation mechanism of IC chips in the environment of polymer viscoelastic melt filling. It is found that the viscoelastic properties of polymer melt have an essential effect on the formation of Thermal-Fluid-solid coupling deformation of IC chips, which reduces the difference of Thermal-Fluid-solid coupling pressure between the upper and lower surfaces of IC chips and the flow stress of viscoelastic melt. The Thermal-Fluid-solid coupling deformation induced by viscoelastic melt filling flow is less than that induced by pure viscous Newtonian melt filling flow. It is found that the main control parameter of the Thermal-Fluid-solid coupling deformation between viscoelastic melt and IC chip is the Thermal-Fluid-solid coupling pressure on the upper and lower surfaces of IC chip. The non-uniform temperature field induced by conjugate heat transfer between viscoelastic melt and IC chip promotes the Thermal-Fluid-solid coupling deformation of IC chip, and the enhancement effect increases with the increase of melt filling time. The flow normal stress field of viscoelastic melt inhibits the Thermal-Fluid-solid coupling deformation of IC chip, and the inhibition effect increases with the melt filling time. The filling time increases and decreases.
【学位授予单位】：南昌大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TN405
本文编号：2209878
[Abstract]:In the process of IC chip packaging, the coupling deformation between the filling flow of package melt and the thermal-fluid-structure interaction of IC chip will seriously affect the performance of IC chip. It is difficult to accurately describe the formation mechanism of Thermal-Fluid-solid coupling deformation of IC chips based on the existing theory of Thermo-Fluid-Solid coupling deformation prediction based on pure viscous Newtonian fluids. Therefore, a theoretical model is established to describe the formation mechanism of Thermal-Fluid-solid coupling deformation of viscoelastic melts and IC chips. It is very important to control the Thermal-Fluid-solid coupling deformation of IC chips. However, this scientific problem has not been solved yet. Therefore, the theoretical study of this scientific problem is carried out in this paper, and the virtual simulation technology of the viscoelastic Thermal-Fluid-solid coupling deformation process of IC chips is established. The theory of correlation between deformation and viscoelastic rheological parameters and process parameters reveals the forming mechanism of viscoelastic Thermo-Fluid-Solid coupling deformation, which makes the design of IC molding process and die "rule-based", and realizes the "whole process synthesis" of IC molding process from "exploring manufacturing" to "seeking quality scientifically" to ensure the success of technology. The theoretical basis for the leap forward transformation of "integrated control of industrial scientific manufacturing" has been laid. The results of comparative analysis of viscoelastic and pure viscous melt IC molding process show that there is essential difference between viscoelastic melt and IC chip Thermo-Fluid-Solid coupling effect and pure viscoelastic melt and IC chip Thermo-Fluid-Solid coupling effect. The mechanism of thermo-fluid-structure interaction between IC chip and IC chip is discussed. The deformation mechanism of IC chip under the interaction of viscoelastic melt and IC chip's Thermo-Fluid-Solid coupling pressure field, temperature field and stress field is the theoretical premise of accurately predicting the Thermo-Fluid-Solid coupling deformation of IC chip and developing the precise Thermo-Fluid-Solid coupling deformation control technology of IC chip. Based on the PTT viscoelastic constitutive model, a theoretical model for accurately describing the Thermal-Fluid-solid coupling effect of viscoelastic melt filling flow and IC chip and the viscoelastic-thermo-fluid-solid multi-field coupling deformation of IC chip was established, and a virtual model for the formation of viscoelastic-thermo-fluid-solid coupling deformation of IC chip was established. The simulation technology provides theoretical support for revealing the deformation mechanism of IC chips in the environment of polymer viscoelastic melt filling. It is found that the viscoelastic properties of polymer melt have an essential effect on the formation of Thermal-Fluid-solid coupling deformation of IC chips, which reduces the difference of Thermal-Fluid-solid coupling pressure between the upper and lower surfaces of IC chips and the flow stress of viscoelastic melt. The Thermal-Fluid-solid coupling deformation induced by viscoelastic melt filling flow is less than that induced by pure viscous Newtonian melt filling flow. It is found that the main control parameter of the Thermal-Fluid-solid coupling deformation between viscoelastic melt and IC chip is the Thermal-Fluid-solid coupling pressure on the upper and lower surfaces of IC chip. The non-uniform temperature field induced by conjugate heat transfer between viscoelastic melt and IC chip promotes the Thermal-Fluid-solid coupling deformation of IC chip, and the enhancement effect increases with the increase of melt filling time. The flow normal stress field of viscoelastic melt inhibits the Thermal-Fluid-solid coupling deformation of IC chip, and the inhibition effect increases with the melt filling time. The filling time increases and decreases.
【学位授予单位】：南昌大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TN405
【参考文献】
相关期刊论文 前6条
1 周国发;宋佳佳;王梅媚;;塑封成型过程芯片热-流-固耦合变形机理数值模拟研究[J];中国塑料;2016年07期
2 杨士勇;刘金刚;何民辉;;微电子封装技术及其聚合物封装材料[J];新材料产业;2012年08期
3 程晓芳;;IC封装技术的发展[J];电子世界;2012年12期
4 刘相;崔熙光;王帅;;均布荷载作用下矩形薄板挠度解法的比较[J];四川建筑;2008年03期
5 成兴明;;IC环氧塑封料性能及其发展趋势[J];集成电路应用;2005年04期
6 申长雨,李海梅,高峰;注射成型技术发展概况[J];工程塑料应用;2003年03期
相关硕士学位论文 前1条
1 王梅媚;微芯片塑封过程热—流—固耦合变形的数值模拟研究[D];南昌大学;2015年
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