单晶硅成型加工刀具损耗建模分析与实验研究
发布时间：2018-09-07 10:37
【摘要】：放电成型加工中的刀具损耗直接影响着加工精度,在单晶Si放电加工可行性的基础上,分析了峰值电流、脉冲宽度以及脉冲间隔对刀具损耗的影响。采用RSM中的中心组合设计实验,建立了与峰值电流、脉冲宽度、脉冲间隔等工艺参数相关的刀具损耗预测模型,用Design-Expert 8.0对刀具损耗与工艺参数的2阶响应曲面进行了分析。方差分析结果表明,预测模型具有较好的拟合程度和适应性。采用满意度函数(DFA)获得了单晶Si放电加工刀具损耗的最佳工艺参数组合,最佳工艺参数下的实验结果与模型预测结果平均相对误差为5.1%。验证实验表明,该模型对刀具损耗的预测是准确的,并且能实现相应的半导体材料的放电成型加工过程中的刀具损耗预测。
[Abstract]:Cutting tool loss directly affects machining accuracy in discharge forming. Based on the feasibility of single crystal Si discharge machining, the effects of peak current, pulse width and pulse interval on tool loss are analyzed. A tool loss prediction model related to peak current, pulse width and pulse interval was established by using the center combination design experiment in RSM. The second-order response surface between tool loss and process parameters was analyzed by Design-Expert 8.0. The results of variance analysis show that the prediction model has good fitting degree and adaptability. The optimum process parameters of tool loss for single crystal Si discharge machining were obtained by using the satisfaction function (DFA). The average relative error between the experimental results and the model prediction results was 5.1. The experimental results show that the model is accurate in predicting tool loss and can be used to predict the tool loss in the process of discharge molding of semiconductor materials.
【作者单位】： 西安理工大学机械与精密仪器工程学院;
【基金】：国家自然科学基金项目(51575442) 陕西省自然基金项目(2016JZ011) 陕西省教育厅基金(2014SZS10-Z01)
【分类号】：TN305.1
本文编号：2228021
[Abstract]:Cutting tool loss directly affects machining accuracy in discharge forming. Based on the feasibility of single crystal Si discharge machining, the effects of peak current, pulse width and pulse interval on tool loss are analyzed. A tool loss prediction model related to peak current, pulse width and pulse interval was established by using the center combination design experiment in RSM. The second-order response surface between tool loss and process parameters was analyzed by Design-Expert 8.0. The results of variance analysis show that the prediction model has good fitting degree and adaptability. The optimum process parameters of tool loss for single crystal Si discharge machining were obtained by using the satisfaction function (DFA). The average relative error between the experimental results and the model prediction results was 5.1. The experimental results show that the model is accurate in predicting tool loss and can be used to predict the tool loss in the process of discharge molding of semiconductor materials.
【作者单位】： 西安理工大学机械与精密仪器工程学院;
【基金】：国家自然科学基金项目(51575442) 陕西省自然基金项目(2016JZ011) 陕西省教育厅基金(2014SZS10-Z01)
【分类号】：TN305.1
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