制冷型红外探测器组件低温热特性研究

发布时间：2018-09-17 20:46

【摘要】：制冷型红外探测器由于其灵敏度高、响应速度快、探测器距离远等优点,广泛应用于高端武器装备中。由于应用于军事领域,对制冷型红外探测器组件的体积、重量、降温时间、功耗及探测器可靠性等关键性能指标有严苛的要求。通过集成式探测器杜瓦制冷机组件的应用,可从机械结构上优化组件的体积、重量及功耗。对于组件降温时间及探测器可靠性的优化途径,需要通过制冷型红外探测器组件的低温热学特性研究获得。制冷型红外探测器组件低温热学特性,主要指组件因需要在低温下工作而产生的组件热负载、降温时间及探测器封装后可靠性等问题。研究的主要内容包括:各因素对组件制冷降温时间的影响规律、探测器封装后热适配优化方法及组件关键零部件热特性优化技术等。本文针对制冷型红外探测器组件低温热学特性的研究要求,阐明了课题的研究目标,通过理论分析和合理的验证实验以及开展相应关键零部件热特性优化研究,获得了制冷型红外探测器组件相关低温热学特性的影响情况,并制备获得相关热特性优化的关键零部件。本文以320×256规格制冷型红外探测器封装用典型IDDCA组件为例,通过建立传热模型及理论分析,获得了组件降温时间的影响因素;通过开展降温时间影响实验,获得了各因素对组件降温时间的影响规律。本文以320×256规格制冷型红外探测器典型封装结构为例,通过ANSYS仿真分析,分析了在冷平台机械结构一定情况下,膨胀系数对探测器的应力及应变影响情况,并根据应力最优化原则确定了冷平台材料为因瓦4J36;开展了不同材料引线基板在封装前后,对硅电路上表面的应变影响实验,实验结果表明平衡层结构及AlN陶瓷基板对探测器模快封装后的额外应变较小。本文开展了关键零部件热特性优化技术研究工作,通过合理的制备流程设计,制备获得内表面黑化外表面镀金的辐射漏热优化电铸冷屏,使组件在80K下热负载降低约6.6mW;以K508制冷机为对象,开展了低漏热、高强度集成式冷指的制备研究,制备获得集成式冷指零件,与K508制冷机耦合后,在80K下获得约610mW制冷量;开展了高热导率、低膨胀系数的金属复合材料制备研究,并以4J32材料作为基体,30%铜材料作为增强相。制备获得φ21.7mm×0.6mm的金属复合材料基片,其常温下膨胀系数为2.23×10~(-6)K~(-1)、热导率为34.67 W/(m·K)。
[Abstract]:Refrigerated infrared detectors are widely used in high-end weapons because of their high sensitivity, high response speed and long range. Because of its application in military field, the key performance indexes such as volume, weight, cooling time, power consumption and detector reliability are strictly required. Through the application of the integrated detector Dewar refrigerator assembly, the volume, weight and power consumption of the assembly can be optimized from the mechanical structure. To optimize the cooling time and the reliability of the detector, it is necessary to study the low temperature thermal characteristics of the refrigerated infrared detector module. The low temperature thermal characteristics of the refrigerated infrared detector module mainly refer to the thermal load, cooling time and the reliability of the detector package due to the assembly working at low temperature. The main contents of the research include: the influence of various factors on the cooling time of the module, the optimization method of the thermal adaptation after the detector packaging and the optimization technology of the thermal characteristics of the key parts of the module, etc. In this paper, according to the research requirements of the low temperature thermal characteristics of the refrigerated infrared detector assembly, the research objectives are clarified. The research results are analyzed by theoretical analysis and reasonable verification experiments, as well as the research on the optimization of the thermal characteristics of the corresponding key parts. The influence of the low temperature thermal characteristics of the refrigerated infrared detector assembly was obtained, and the key parts for the optimization of the related thermal characteristics were prepared. In this paper, taking the typical IDDCA module of 320 脳 256-specification refrigerated infrared detector package as an example, the factors influencing the cooling time of the module are obtained by establishing the heat transfer model and theoretical analysis, and the experiment of cooling down time is carried out. The effects of various factors on the cooling time of the components are obtained. In this paper, the typical packaging structure of 320 脳 256-specification refrigerated infrared detector is taken as an example, and the influence of expansion coefficient on the stress and strain of the detector is analyzed by ANSYS simulation analysis under the certain mechanical structure of the cold platform. According to the principle of stress optimization, the cold platform material was determined to be Involva 4J36, and the strain effect experiments of different material lead substrates on the upper surface of silicon circuit were carried out before and after packaging. The experimental results show that the extra strain of the balanced layer structure and the AlN ceramic substrate is small after the fast packaging of the detector mode. In this paper, the optimization technology of the thermal characteristics of key parts is studied. Through the reasonable preparation process design, the radiative heat leakage optimized electroforming cold screen is prepared to blacken the inner surface of the outer surface and plated the gold on the outer surface of the inner surface. The heat load of the assembly is reduced by about 6.6 MW at 80K, and the low heat leakage and high strength integrated cold finger is prepared by using K508 refrigerator as the object. The integrated cold finger parts are prepared and coupled with the K508 refrigerator, and the 610mW refrigerating capacity is obtained at 80K. The preparation of metal composites with high thermal conductivity and low coefficient of expansion was studied. The 4J32 material was used as the matrix and 30% copper as the reinforcement phase. The metal composite substrates with 蠁 21.7mm 脳 0.6mm were prepared. The expansion coefficient was 2.23 脳 10 ~ (-6) K ~ (-1) and the thermal conductivity was 34.67 W / (m K). At room temperature.
【学位授予单位】：中国科学院大学(中国科学院上海技术物理研究所)
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TN215

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