非制冷红外焦平面阵列信号处理电路的设计

发布时间：2018-09-19 19:35

【摘要】：红外焦平面技术涉及的内容包括红外辐射的探测、转变和使用。这种高科技的红外技术，涵盖了材料学、光学、MEMS和微电子等好多个方面，范围非常广。在国防的信息化和现代化进程中，红外技术的意义重大，很多民用领域也离不开它。红外焦平面阵列(IRFPA)包括两个部分，前端是探测器，后面接的是读出电路。本次毕业设计内容的重点是读出电路的设计和后面调制器的设计。非制冷红外焦平面阵列作为目前低成本的第四代红外热成像器件，正在朝着二维大面阵的方向发展。多功能集成、系统的简易化、后续信号处理技术的增强将会越来越吸引研究人员的研究兴趣。通过将供电模块以及时序控制模块和非制冷红外焦平面阵列读出电路实现系统单芯片集成，系统的集成度以及稳定性将得到显著提升，是未来非制冷红外焦平面阵列的发展方向。本文基于CTIA型读出电路结构，设计实现了1×8线列微测辐射热计型焦平面阵列单芯片全集成型信号处理电路。仿真和测试验证表明，，所设计电路能够完成预设功能。论文内容安排如下：首先，介绍了非制冷红外焦平面的基本概况；其次，针对微测辐射热计型红外焦平面阵列，确定其读出电路总体架构，给出了各模块电路设计；再次，给出了信号处理后端所需的Sigma-Delta调制器设计，并进行了系统联调仿真验证；最后，对读出电路模块电路进行了详细测试并给出了未来红外读出电路设计的发展展望。本文设计了一种红外焦平面信号处理电路，基于中芯国际0.18μm CMOS工艺，采用CTIA型单元读出电路结构，实现了偏置模块、驱动信号源模块、电流积分模块、相关双采样模块(CDS)、缓冲输出模块的单芯片集成,成功制造了1×8读出电路原型。仿真结果表明，热敏电阻与输出电压之间的线性度达到了99.94%，输出稳定，能很好地实现读出功能，适合于大面阵移植。调制器的过采样率为128，20kHz的带宽，后仿真的信噪比能够达到97dB。设计的三阶Δ-Σ调制器采用中芯国际0.18μm CMOS工艺实现，1.8V的电源电压下，功耗仅为480μW，为红外焦平面阵列信号的并行读取奠定了研究基础。
[Abstract]:Infrared focal plane technology involves the detection, transformation and use of infrared radiation. This high-tech infrared technology covers a wide range of fields, such as materials science, optical MEMS and microelectronics. In the process of information and modernization of national defense, infrared technology is of great significance. The infrared focal plane array (IRFPA) consists of two parts: a detector at the front end and a readout circuit at the back. This graduation design focuses on the readout circuit design and the design of the rear modulator. As a low-cost fourth generation infrared thermal imaging device, uncooled infrared focal plane array is developing towards the direction of two-dimensional large plane array. The multifunctional integration, the simplification of the system and the enhancement of the subsequent signal processing technology will attract more and more researchers' interest. Through the integration of power supply module, timing control module and uncooled infrared focal plane array readout circuit, the integration and stability of the system will be greatly improved. Is the future uncooled infrared focal plane array development direction. Based on the structure of CTIA readout circuit, a 1 脳 8 line microbolometer single-chip signal processing circuit is designed and implemented in this paper. Simulation and test results show that the designed circuit can accomplish the preset function. The contents of the thesis are as follows: firstly, the basic situation of uncooled infrared focal plane is introduced; secondly, the overall structure of readout circuit is determined for the micro-bolometer infrared focal plane array, and the circuit design of each module is given. The design of Sigma-Delta modulator for the back end of signal processing is given, and the simulation of system coupling is carried out. Finally, the readout circuit module circuit is tested in detail and the development prospect of infrared readout circuit design in the future is given. In this paper, a kind of infrared focal plane signal processing circuit is designed. Based on SMIC 0.18 渭 m CMOS technology, the readout circuit structure of CTIA unit is adopted. The bias module, driving signal source module and current integral module are realized. The 1 脳 8 readout circuit prototype has been successfully fabricated by the single chip integration of the (CDS), buffer output module. The simulation results show that the linearity between the thermistor and the output voltage is 99.94, the output is stable, and the readout function can be realized well, which is suitable for the transplantation of large array. The over-sampling rate of the modulator is 128kHz and the post-simulated SNR can reach 97 dB. The designed third-order 螖-危 modulator uses the SMIC 0.18 渭 m CMOS process to realize the power consumption of only 480 渭 W at 1.8 V, which lays a foundation for parallel reading of the infrared focal plane array (IRFPA) signals.
【学位授予单位】：北京理工大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN219;TN911.7

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