金属熔融挤出沉积的PCB直写技术研究
发布时间：2018-10-13 15:45
【摘要】：传统铜箔蚀刻法的PCB布线工艺流程复杂、生产成本高并造成十分严重的环境污染,而新型微流动沉积直写技术使用材料仅限于功能液体浆料。为实现PCB布线直写工艺的应用,提出了金属熔融挤出沉积成型方法。针对PCB基板不耐高温的难点,设计直写—转移—后处理三步骤,利用耐高温的陶瓷基板中间过渡,完成直写和图形转移两步流程。该技术方案突破了微流动沉积材料的局限性,并提出了新的PCB布线直写的可行性工艺流程。本文阐述了气动式金属熔融挤出沉积成型装置的工作原理,分析气压驱动熔融金属微小孔出流的流场情况,建立了管嘴出流模型,指出相关参数对出流规律和沉积成型质量的影响。设计并搭建了气动式挤出沉积成型系统,分别对运动系统、气动控制系统、温度控制装置、软件操作系统四个模块的组建及功能进行了较为详细的分析和说明。以金属熔融挤出沉积成型系统为工作平台,Sn-0.7Cu为实验材料,研究了挤出沉积直写装置的工作机理与性能,针对PCB基板上直写不同线型的一般规律作了相关阐述。结合理论研究和实验数据结果,分析驱动气压、加热温度、喷嘴直径、喷嘴距离基板高度和走线速度对成型导线尺寸的影响。研究了喷嘴“涂抹”直写模型和成型过程中出现“积高”和“断流”质量缺陷的一般规律。通过平面布线实验,不断调整各个参数的交互影响,基本解决了“积高”和“断流”等质量缺陷,成功利用0.2mm直径喷嘴沉积直写得到横截面尺寸为0.15mm高、0.3mm宽的导线图形,持续稳定布线效率可以达到10mm·s-1。验证了该装置的可靠性和气动挤出沉积原理工艺实现PCB布线的可行性。
[Abstract]:The PCB wiring process of traditional copper foil etching process is complex, the production cost is high and the environment pollution is very serious. However, the new micro-flow deposition direct-writing technology is limited to the functional liquid slurry. In order to realize the application of PCB wiring direct writing process, a metal melt extrusion deposition forming method was proposed. Aiming at the difficulty of high temperature resistance of PCB substrate, three steps of direct write, transfer and post processing are designed, and two steps of direct writing and graphics transfer are completed by using the intermediate transition of high temperature resistant ceramic substrate. The technical scheme breaks through the limitation of micro-flow deposition material, and puts forward a new feasible process of PCB wiring direct writing. In this paper, the working principle of pneumatic metal melt extrusion deposition forming device is described, the flow field of gas pressure driven melt metal micro pore is analyzed, and the outlet flow model of pipe nozzle is established. The influence of relevant parameters on the flow rule and deposition quality is pointed out. A pneumatic extrusion deposition molding system is designed and built. The construction and functions of four modules, namely, motion system, pneumatic control system, temperature control device and software operating system, are analyzed and explained in detail. Based on the metal melt extrusion deposition forming system and Sn-0.7Cu as the experimental material, the working mechanism and performance of the extrusion deposition direct-writing device were studied, and the general rules of different lines of direct writing on the PCB substrate were expounded. The effects of driving pressure, heating temperature, nozzle diameter, nozzle distance from substrate height and line velocity on the dimension of the wire are analyzed. The direct writing model of nozzle "smear" and the general rule of quality defects of "product height" and "cut off" in the molding process are studied. Through the plane wiring experiment, the interactive influence of various parameters is adjusted constantly, and the quality defects such as "product height" and "current breakage" are basically solved, and the traverse pattern with high cross-section size and wide 0.3mm width can be obtained by using 0.2mm diameter nozzle deposition directly. The continuous and stable routing efficiency can reach 10mm s-1. The reliability of the device and the feasibility of PCB routing by pneumatic extrusion deposition process are verified.
【学位授予单位】：华中科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN41
本文编号：2269147
[Abstract]:The PCB wiring process of traditional copper foil etching process is complex, the production cost is high and the environment pollution is very serious. However, the new micro-flow deposition direct-writing technology is limited to the functional liquid slurry. In order to realize the application of PCB wiring direct writing process, a metal melt extrusion deposition forming method was proposed. Aiming at the difficulty of high temperature resistance of PCB substrate, three steps of direct write, transfer and post processing are designed, and two steps of direct writing and graphics transfer are completed by using the intermediate transition of high temperature resistant ceramic substrate. The technical scheme breaks through the limitation of micro-flow deposition material, and puts forward a new feasible process of PCB wiring direct writing. In this paper, the working principle of pneumatic metal melt extrusion deposition forming device is described, the flow field of gas pressure driven melt metal micro pore is analyzed, and the outlet flow model of pipe nozzle is established. The influence of relevant parameters on the flow rule and deposition quality is pointed out. A pneumatic extrusion deposition molding system is designed and built. The construction and functions of four modules, namely, motion system, pneumatic control system, temperature control device and software operating system, are analyzed and explained in detail. Based on the metal melt extrusion deposition forming system and Sn-0.7Cu as the experimental material, the working mechanism and performance of the extrusion deposition direct-writing device were studied, and the general rules of different lines of direct writing on the PCB substrate were expounded. The effects of driving pressure, heating temperature, nozzle diameter, nozzle distance from substrate height and line velocity on the dimension of the wire are analyzed. The direct writing model of nozzle "smear" and the general rule of quality defects of "product height" and "cut off" in the molding process are studied. Through the plane wiring experiment, the interactive influence of various parameters is adjusted constantly, and the quality defects such as "product height" and "current breakage" are basically solved, and the traverse pattern with high cross-section size and wide 0.3mm width can be obtained by using 0.2mm diameter nozzle deposition directly. The continuous and stable routing efficiency can reach 10mm s-1. The reliability of the device and the feasibility of PCB routing by pneumatic extrusion deposition process are verified.
【学位授予单位】：华中科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN41
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1 陈鹏;金属熔融挤出沉积的PCB直写技术研究[D];华中科技大学;2015年
，本文编号：2269147
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