复杂条件下微波多层电路层间互连结构电磁特性的研究与分析
发布时间：2018-10-23 07:58
【摘要】：随着微波集成电路小型化及高速化发展进程的加快,多层电路的互连仿真技术对于板级电路设计以及信号完整性的分析也变的越来越重要,使用纯粹的数值计算和商用仿真软件来研究复杂条件下多层电路的层间互连结构已经无法满足科研领域对电磁分析高精度和快速度的要求。本文以复杂条件下微波多层电路层间互连结构为研究对象,以微波网络、电磁场理论以及电磁场数值计算方法等理论为研究基础,完成了以下工作:对复杂条件下微波多层电路层间互连结构进行了物理建模,根据其结构特点将其分解为内部结构和外部结构,并对内部结构和外部结构的影响因素以及分析方法进行了探讨,实现了一种混合的分析方法对微波多层电路层间互连结构进行分析的思路。采用矩阵束矩量法分析过孔的外部结构,选用RWG函数做为基函数生成对应的三角形网格面元,应用矩量法求解过孔外部结构的表面电流分布,再应用矩阵束矩量法提取其电流极值,从而实现对过孔外部结构散射参数的求解。采用过孔的本征电路模型来分析复杂条件下过孔内部结构的电磁特性,引入了过孔本征三端口网络电路模型和五端口网络电路模型,并对三端口网络电路模型和五端口网络电路模型进行了分析,研究了复杂条件下过孔内部结构电路模型中平行板阻抗的引入过程,并采用边界积分方程法实现复杂条件下过孔内部结构平行板阻抗的求解。采用递归的导纳参数级联的方法实现过孔内部结构层间互连后散射参数的求解,采用散射参数级联的方法实现过孔内、外部结构互连后完整结构散射参数的求解。最后采用HFSS仿真软件验证了过孔外部结构、内部结构以及整体结构的分析方法的可行性,并应用该分析方法对过孔传输受其关键参数的影响以及孔间信号的传输规律进行了讨论。
[Abstract]:With the development of miniaturization and high speed of microwave integrated circuits, the interconnection simulation technology of multilayer circuits is becoming more and more important for the design of board level circuits and the analysis of signal integrity. Using pure numerical calculation and commercial simulation software to study the interlayer interconnection structure of multilayer circuits under complex conditions can no longer meet the requirements of high precision and high speed for electromagnetic analysis in the field of scientific research. In this paper, the interconnect structure of microwave multilayer circuits under complex conditions is taken as the research object, and the theory of microwave network, the theory of electromagnetic field and the numerical calculation method of electromagnetic field are taken as the basis. The following works have been accomplished: physical modeling of interlayer interconnection structure of microwave multilayer circuits under complex conditions is carried out. According to its structural characteristics, it is decomposed into internal and external structures. The influence factors and analysis methods of internal and external structures are discussed, and a hybrid analysis method is realized to analyze the interlayer interconnection structure of microwave multilayer circuits. The matrix beam moment method is used to analyze the external structure of the hole, the RWG function is used as the basis function to generate the corresponding triangular mesh surface element, and the moment method is applied to solve the surface current distribution of the external structure. The method of matrix beam moment is used to extract the current extremum, and the scattering parameters of the external structure through the hole are solved. The intrinsic circuit model of perforation is used to analyze the electromagnetic characteristics of the internal structure of the hole under complex conditions, and the intrinsic three-port network model and the five-port network circuit model are introduced. The three-port network circuit model and the five-port network circuit model are analyzed, and the introduction process of parallel plate impedance in the circuit model of the internal structure through a hole under complex conditions is studied. The boundary integral equation method is used to solve the impedance of parallel plate of the internal structure under complex conditions. The recursive admittance parameter cascade method is used to solve the scattering parameters after interconnecting the internal structure of the hole, and the scattering parameter cascade method is used to solve the scattering parameters of the complete structure after the interconnection of the internal and external structures. Finally, HFSS simulation software is used to verify the feasibility of the analysis method of the external structure, the internal structure and the whole structure of the hole. The method is applied to discuss the influence of the key parameters and the transmission law of the signal between the holes.
【学位授予单位】：电子科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN405.97
[Abstract]:With the development of miniaturization and high speed of microwave integrated circuits, the interconnection simulation technology of multilayer circuits is becoming more and more important for the design of board level circuits and the analysis of signal integrity. Using pure numerical calculation and commercial simulation software to study the interlayer interconnection structure of multilayer circuits under complex conditions can no longer meet the requirements of high precision and high speed for electromagnetic analysis in the field of scientific research. In this paper, the interconnect structure of microwave multilayer circuits under complex conditions is taken as the research object, and the theory of microwave network, the theory of electromagnetic field and the numerical calculation method of electromagnetic field are taken as the basis. The following works have been accomplished: physical modeling of interlayer interconnection structure of microwave multilayer circuits under complex conditions is carried out. According to its structural characteristics, it is decomposed into internal and external structures. The influence factors and analysis methods of internal and external structures are discussed, and a hybrid analysis method is realized to analyze the interlayer interconnection structure of microwave multilayer circuits. The matrix beam moment method is used to analyze the external structure of the hole, the RWG function is used as the basis function to generate the corresponding triangular mesh surface element, and the moment method is applied to solve the surface current distribution of the external structure. The method of matrix beam moment is used to extract the current extremum, and the scattering parameters of the external structure through the hole are solved. The intrinsic circuit model of perforation is used to analyze the electromagnetic characteristics of the internal structure of the hole under complex conditions, and the intrinsic three-port network model and the five-port network circuit model are introduced. The three-port network circuit model and the five-port network circuit model are analyzed, and the introduction process of parallel plate impedance in the circuit model of the internal structure through a hole under complex conditions is studied. The boundary integral equation method is used to solve the impedance of parallel plate of the internal structure under complex conditions. The recursive admittance parameter cascade method is used to solve the scattering parameters after interconnecting the internal structure of the hole, and the scattering parameter cascade method is used to solve the scattering parameters of the complete structure after the interconnection of the internal and external structures. Finally, HFSS simulation software is used to verify the feasibility of the analysis method of the external structure, the internal structure and the whole structure of the hole. The method is applied to discuss the influence of the key parameters and the transmission law of the signal between the holes.
【学位授予单位】：电子科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN405.97
【相似文献】
相关期刊论文 前10条
1 钱晓宁,郑戟,李征帆;小波多分辨率分析改进互连结构电容提取[J];电子学报;1999年05期
2 Kathleen Nargi-Toth;Pradeep Gandhi;丁志廉;;高密度互连结构[J];印制电路信息;2000年12期
3 朱震海，洪伟;超大规模集成电路中互连结构的逻辑模型[J];电子学报;1997年02期
4 郑戟,李征帆;高速集成电路三维互连结构电容参数的多重网格法提取[J];上海交通大学学报;1998年04期
5 郑戟,李征帆;高速电路中三维互连结构频变电感参数的提取[J];上海交通大学学报;1999年01期
6 邵振海,洪伟;三维多导体互连结构交扰问题的时域分析[J];电子学报;2000年02期
7 刘心松 ,彭寿全;分布式，
本文编号：2288595
本文链接：https://www.wllwen.com/kejilunwen/dianzigongchenglunwen/2288595.html
