一种无排气嘴型非制冷红外焦平面探测器的封装设计与研究
发布时间：2018-10-26 11:42
【摘要】：非制冷红外焦平面探测器的封装设计在提高器件真空寿命和满足器件的光学、力学、热学等需求中有重要的应用价值。本文以无排气嘴型非制冷探测器为例,分析封装设计涉及的各个方面,给出设计一般流程,系统说明此类型紧密电子器件系列设计工作和总结具体生产的文本文件,为器件实际生产提供有力的保证和依据。首先,本文介绍了现常用的器件级非制冷红外探测器,叙述芯片热辐射吸收的工作环境要求和封装工作的不足,说明探测器真空封装和设计工作必要性。同时分析了现用探测器的不足,提出探测器的一种无排气嘴陶瓷封装样式。介绍了电子器件一般性的封装设计,给出设计流程和依据。系统介绍红外探测器封装设计整体流程,从无排气嘴型非制冷红外探测器封装设计总体要求,结合力、热、光、电等方面,结果确定目标探测器的原材料或零部件。在满足总体装配设计原则要求下,运用SolidWorks软件进行合理结构设计和COMSOL Multiphysics软件进行模拟仿真,给出具体目标探测器装配样式。通过分析集成的红外窗口强度,给出窗口厚度范围值和粘接强度;通过分析内部零部件的耐冲击强度,给出零部件焊接或粘接强度要求。简化目标探测器热传递模式,选用合适半导体制冷器为芯片提供稳定工作温度点。描述目标探测器正常工作对真空环境的需求,提出安置微型真空规以实时监测器件内真空值变化,说明非蒸散型吸气剂的选用必要性和使用要求。对上述目标探测器进行详细的封装工艺设计,包括贴片工艺设计和一体化排气、激活和封装工艺实施设计。本文选用3500贴片机实现目标探测器高精密度贴片工艺要求,并给出详细实施过程说明。本文采用专用的排气台,可同时实现检漏、烘烤排气和隔断,简化工艺。本文选用的液态吸气剂,可以与红外窗口集成一体,缩小占用体积、扩大吸气表面积;该吸气剂在隔离环境下激活,激活的温度和时间需严格把控。本文选用含铟熔合金的钱焊料,可满足本目标探测器对低温工艺特殊要求。总结完整的探测器封装设计和工艺设计流程,为今后同种类型器件或其他微电子器件设计和生产提供系统参照。
[Abstract]:The packaging design of uncooled infrared focal plane detector has important application value in increasing the vacuum life of the device and satisfying the optical, mechanical and thermal requirements of the device. Taking the uncooled detector without exhaust nozzle as an example, this paper analyzes the various aspects of package design, gives the general design flow, systematically explains the design work of this type of compact electronic device series and summarizes the text file of concrete production. To provide a strong guarantee and basis for the actual production of the device. First of all, this paper introduces the common uncooled infrared detector, describes the working environment requirements of the chip thermal radiation absorption and the shortage of packaging work, and explains the necessity of vacuum packaging and design of the detector. At the same time, the deficiency of the current detector is analyzed, and a ceramic packaging style of the detector without exhaust nozzle is proposed. The general package design of electronic devices is introduced, and the design flow and basis are given. The whole design process of infrared detector package is introduced systematically. From the general requirements of packaging design of uncooled infrared detector without exhaust nozzle, binding force, heat, light and electricity, the results determine the raw materials or parts of the target detector. In order to meet the requirements of the general assembly design principle, reasonable structure design with SolidWorks software and simulation with COMSOL Multiphysics software are carried out, and the assembly style of the specific target detector is given. By analyzing the integrated infrared window strength, the range of window thickness and bonding strength are given, and the requirements of welding or bonding strength are given by analyzing the impact strength of internal parts. The heat transfer mode of the target detector is simplified and the suitable semiconductor cooler is selected to provide the stable working temperature point for the chip. This paper describes the requirements of the target detector for the vacuum environment in normal operation, and puts forward a micro vacuum gauge to monitor the vacuum value change in the device in real time. The necessity and application requirements of the selection of non-evapotranspiration getter are explained. Detailed package process design of the above target detector, including chip process design and integrated exhaust, activation and packaging process implementation design. In this paper, 3500 mounting machine is used to realize the high precision chip technology requirement of target detector, and the detailed implementation process is given. In this paper, a special exhaust platform can be used to detect leakage, bake exhaust and partition, and simplify the process. The liquid getter selected in this paper can be integrated with the infrared window to reduce the occupied volume and enlarge the inspiratory surface area. The getter is activated in isolation environment and the activation temperature and time need to be strictly controlled. In this paper, Qian solder containing indium melting alloy can meet the special requirements of the target detector for low temperature process. The complete package design and process design flow of detector are summarized to provide system reference for the design and production of the same type of devices or other microelectronic devices in the future.
【学位授予单位】：电子科技大学
【学位级别】：硕士
【学位授予年份】：2016
【分类号】：TN215
[Abstract]:The packaging design of uncooled infrared focal plane detector has important application value in increasing the vacuum life of the device and satisfying the optical, mechanical and thermal requirements of the device. Taking the uncooled detector without exhaust nozzle as an example, this paper analyzes the various aspects of package design, gives the general design flow, systematically explains the design work of this type of compact electronic device series and summarizes the text file of concrete production. To provide a strong guarantee and basis for the actual production of the device. First of all, this paper introduces the common uncooled infrared detector, describes the working environment requirements of the chip thermal radiation absorption and the shortage of packaging work, and explains the necessity of vacuum packaging and design of the detector. At the same time, the deficiency of the current detector is analyzed, and a ceramic packaging style of the detector without exhaust nozzle is proposed. The general package design of electronic devices is introduced, and the design flow and basis are given. The whole design process of infrared detector package is introduced systematically. From the general requirements of packaging design of uncooled infrared detector without exhaust nozzle, binding force, heat, light and electricity, the results determine the raw materials or parts of the target detector. In order to meet the requirements of the general assembly design principle, reasonable structure design with SolidWorks software and simulation with COMSOL Multiphysics software are carried out, and the assembly style of the specific target detector is given. By analyzing the integrated infrared window strength, the range of window thickness and bonding strength are given, and the requirements of welding or bonding strength are given by analyzing the impact strength of internal parts. The heat transfer mode of the target detector is simplified and the suitable semiconductor cooler is selected to provide the stable working temperature point for the chip. This paper describes the requirements of the target detector for the vacuum environment in normal operation, and puts forward a micro vacuum gauge to monitor the vacuum value change in the device in real time. The necessity and application requirements of the selection of non-evapotranspiration getter are explained. Detailed package process design of the above target detector, including chip process design and integrated exhaust, activation and packaging process implementation design. In this paper, 3500 mounting machine is used to realize the high precision chip technology requirement of target detector, and the detailed implementation process is given. In this paper, a special exhaust platform can be used to detect leakage, bake exhaust and partition, and simplify the process. The liquid getter selected in this paper can be integrated with the infrared window to reduce the occupied volume and enlarge the inspiratory surface area. The getter is activated in isolation environment and the activation temperature and time need to be strictly controlled. In this paper, Qian solder containing indium melting alloy can meet the special requirements of the target detector for low temperature process. The complete package design and process design flow of detector are summarized to provide system reference for the design and production of the same type of devices or other microelectronic devices in the future.
【学位授予单位】：电子科技大学
【学位级别】：硕士
【学位授予年份】：2016
【分类号】：TN215
【参考文献】
相关期刊论文 前10条
1 周玉林;杨铁牛;;IC装备真空腔室的气密性检测试验及分析[J];五邑大学学报(自然科学版);2015年01期
2 魏伟;贾黎明;;利用Solidworks辅助机械制图教学研究[J];安徽工业大学学报(社会科学版);2014年02期
3 王珊珊;宋亮;党向婷;;QMEMS晶振的MEMS器件真空度测量方法研究[J];国外电子测量技术;2014年01期
4 闫浩;朱魁章;仰叶;;一种非致冷红外探测器真空封装的研究[J];低温与超导;2012年11期
5 刘秀军;张金旺;彭W，
本文编号：2295598
本文链接：https://www.wllwen.com/kejilunwen/dianzigongchenglunwen/2295598.html
