新型自动覆膜装置的设计

发布时间：2018-10-31 13:13

【摘要】：本文主要研究新型真空自动覆膜设备的设计与使用。随着芯片封装行业的快速发展,对封装成型工艺的要求也越来越高。真空覆膜设备正是针对目前封装成型技术存在的弊端而提出来的。真空覆膜技术利用气压差实现PCBA的封装,由于其功能原理简单,相比之下成本低,且成型效率高。目前真空覆膜设备的加工参数都是通过大量的试验确定的,不仅造成了极大的人力和物力浪费,而且严重影响了真空覆膜设备的产业化发展。因此本文设计新型真空覆膜设备具有重要意义。基于覆膜设备需要在真空条件下进行的特点,本文主要研究了以下四个方面的内容:(1)确立该设备研发的目的、要求、功能等,以此确定设备的设计方向;(2)建立合适的辐射传热模型,分析胶膜表面温度分布情况,为设备实际参数的确定提供理论依据;(3)设计覆膜设备的整体结构,包括各个机械加工件的设计、机械标准件的选型以及整体性能的评估等;(4)进行相关试验,观察封装效果并进行分析,对封装参数和流程进行部分优化以提升性能。由于平面间辐射传热过程的复杂性,简单的利用数值计算不足以解决问题,因此结合有限元软件ANSYS得出最佳的参数值。本文得到了覆膜设备的样机。利用设备进行相关封装试验,得到了无气泡、黏贴良好以及没有破损的封装产品,表明本文所设计的覆膜封装设备符合预期的设计要求。该设备具有结构精简、操作方便、稳定性高、自动化程度高等优点,满足了现代封装生产的要求,具有很广的应用前景。
[Abstract]:In this paper, the design and application of a new vacuum automatic film coating equipment are studied. With the rapid development of chip packaging industry, the requirements of packaging molding technology are becoming higher and higher. The vacuum film coating equipment is put forward in view of the disadvantages of the current packaging and forming technology. Vacuum film coating technology uses air pressure difference to realize the packaging of PCBA, because of its simple function principle, low cost and high forming efficiency. At present, the processing parameters of vacuum film mulching equipment are determined by a large number of experiments, which not only cause a great waste of manpower and material resources, but also seriously affect the industrialization development of vacuum film mulching equipment. Therefore, it is of great significance to design a new vacuum film coating equipment in this paper. Based on the characteristics of film mulching equipment under vacuum condition, this paper mainly studies the following four aspects: (1) to establish the purpose, requirements and functions of the equipment research and development, so as to determine the design direction of the equipment; (2) establishing a suitable radiation heat transfer model, analyzing the surface temperature distribution of the film, and providing the theoretical basis for the determination of the actual parameters of the equipment; (3) designing the whole structure of the coating equipment, including the design of each mechanical workpiece, the selection of the mechanical standard parts and the evaluation of the whole performance, etc. (4) relevant experiments were carried out to observe and analyze the package effect and to optimize the package parameters and process to improve the performance. Because of the complexity of the radiation heat transfer process between planes, simple numerical calculation is not enough to solve the problem, so the optimal parameter value can be obtained by using the finite element software ANSYS. In this paper, the prototype of film mulching equipment is obtained. The packaging products with no bubble, good adhesion and no breakage were obtained by using the equipment. It shows that the packaging equipment designed in this paper accords with the expected design requirements. The equipment has the advantages of simple structure, convenient operation, high stability and high degree of automation. It meets the requirements of modern packaging production and has a wide application prospect.
【学位授予单位】：南京理工大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TN405

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