玻璃基板COB封装的LED性能研究
发布时间：2018-11-26 10:11
【摘要】：在全球经济迅猛发展的背景下,能源供给的紧张局面日益加剧。面对如此紧迫的危机,我国政府全力提倡可持续发展战略,既要加速开辟新的可再生能源,更要全民参与低碳生活政策。在各种新能源中,最受瞩目的要数半导体发光二极管,简称LED。相对于传统光源,LED凭借着电光转换效率高、使用寿命长、响应速度快以及抗震性能好等优点,广泛应用于日常生活中的各个领域,被评为新世纪最有价值的照明光源。随着LED应用领域的逐渐扩大,人们对LED的输出功率以及光效的要求也在不断攀升。高功率、高集成度的发展趋势给LED封装行业带来了前所未有的挑战。研究者们通过研发新型封装材料、改变封装结构等方式,来解决光效、散热、光色以及成本控制等一系列难题。本文以最近研究火热的玻璃基板灯丝球泡灯为契机,采用COB(chip on board,板上芯片)封装结构,对玻璃材质作为LED封装基板的性能进行研究。基于玻璃基板COB器件,本文主要进行了以下几个方面的研究工作:1、针对不同基板材质,选取常用陶瓷、普通的硅酸盐玻璃、铜、硅和铝等基板进行样品制作和性能对比实验。分析测试数据知:17串1并的条状玻璃基板COB样品在49V、20m A的工作状态下,92℃的胶面温度高于其它样品,却有着和陶瓷基板COB器件相近的76 lm光通量。2、为改善玻璃基板COB器件散热性能,设计了铝材弹片、铝材卡口和玻璃基板背面刷银层的实验方案。得知采用铝材卡口+基板背面刷银层的方式散热效果最理想。3、设计对比实验,研究了背面银层厚度与散热性能和光通量的关系。当银层厚度为75um时,达到了比较理想的散热和发光效果。胶体表面温度为91.5℃,3.6W的玻璃条球泡灯在稳定状态下的光通量达到315 lm。4、针对玻璃基板COB器件的可靠性,进行了高温高湿、冷热冲击和红墨水硫磺实验,并与市场主流的Al2O3陶瓷基板进行了对比分析。实验结果表明玻璃基板COB器件能够顺利的通过可靠性实验,背面刷银层后,可靠性效果更优。本文通过制样和对比分析,对玻璃材质作为COB的封装基板进行了研究,并设计了一些简单的方法改善玻璃基板的散热性能。为未来大功率集成式玻璃基板COB封装结构的研究提供参考。
[Abstract]:In the context of the rapid development of the global economy, the tension of energy supply is increasing day by day. In the face of such an urgent crisis, our government fully advocates the strategy of sustainable development. It is necessary to accelerate the development of new renewable energy sources and to participate in low-carbon living policies. Of all the new sources of energy, semiconductor light-emitting diodes (LED.) are the most popular ones. Compared with the traditional light source, LED is widely used in every field of daily life because of its advantages of high efficiency of electro-optic conversion, long service life, fast response speed and good seismic performance, and is regarded as the most valuable lighting source in the new century. With the gradual expansion of LED applications, the demand for LED output power and light efficiency is also increasing. The development trend of high power and high integration has brought unprecedented challenges to LED packaging industry. Researchers solve a series of problems such as light efficiency, heat dissipation, light color and cost control by developing new packaging materials and changing packaging structure. In this paper, the recent research on the hot glass substrate filament bulb lamp is taken as the turning point, and the performance of the glass material as the LED packaging substrate is studied by using the COB (chip on board, on-board chip) packaging structure. Based on the glass substrate COB device, this paper mainly carried out the following research work: 1, for different substrate materials, common ceramic, common silicate glass, copper, Silicon and aluminum substrates were prepared and the properties were compared. The experimental data show that the surface temperature at 92 鈩，
本文编号：2358260
[Abstract]:In the context of the rapid development of the global economy, the tension of energy supply is increasing day by day. In the face of such an urgent crisis, our government fully advocates the strategy of sustainable development. It is necessary to accelerate the development of new renewable energy sources and to participate in low-carbon living policies. Of all the new sources of energy, semiconductor light-emitting diodes (LED.) are the most popular ones. Compared with the traditional light source, LED is widely used in every field of daily life because of its advantages of high efficiency of electro-optic conversion, long service life, fast response speed and good seismic performance, and is regarded as the most valuable lighting source in the new century. With the gradual expansion of LED applications, the demand for LED output power and light efficiency is also increasing. The development trend of high power and high integration has brought unprecedented challenges to LED packaging industry. Researchers solve a series of problems such as light efficiency, heat dissipation, light color and cost control by developing new packaging materials and changing packaging structure. In this paper, the recent research on the hot glass substrate filament bulb lamp is taken as the turning point, and the performance of the glass material as the LED packaging substrate is studied by using the COB (chip on board, on-board chip) packaging structure. Based on the glass substrate COB device, this paper mainly carried out the following research work: 1, for different substrate materials, common ceramic, common silicate glass, copper, Silicon and aluminum substrates were prepared and the properties were compared. The experimental data show that the surface temperature at 92 鈩，
本文编号：2358260
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