IC产品新型封装模具设计研究

发布时间：2018-12-13 06:56

【摘要】：半导体产业的急速发展推动着半导体封装技术的进步,高密度平面阵列表面贴片式封装将成为主流高端的微IC封装形式；同时,随着对环保问题的高度关注,对环境友好的绿色环氧模塑料得到广泛使用。这些都对与之息息相关的封装模具设计制造技术提出了新的要求。本文通过对IC产品结构特点及质量要求、绿色环氧模塑料的性能、高密度平面阵列型表面贴片式EMC封装等进行分析研究,在以往模具设计制造经验的基础上,利用CAD/CAE技术,优化了浇注系统、排气系统的设计,确定了新型模具浇注系统、排气系统的设计方案。创新地提出脱模系统中的上模二次顶出机构,改善了以往模具与塑封体分离时,中心部位粘膜力大导致的产品翘曲、分层等不良现象。通过模具及产品加工试验分析、试制验证,最终确定了模具设计方案。本文设计研究的这类新型封装模具,从模具结构设计方面,解决了使用绿色环氧模塑料EMC封装时成型质量和应力控制的诸多问题,提高成品质量和生产效率。新型封装模具也可扩大绿色环氧模塑料EMC的选择范围,降低了封装成本。
[Abstract]:The rapid development of semiconductor industry promotes the progress of semiconductor packaging technology. High-density planar array surface mount packaging will become the mainstream high-end micro-IC packaging form. At the same time, environmental friendly green epoxy moulded plastics have been widely used with the attention of environmental protection. These all put forward new requirements to the packaging die design and manufacture technology which is closely related to it. In this paper, the structural characteristics and quality requirements of IC products, the properties of green epoxy moulding plastics and the high density planar array surface mount EMC packaging are analyzed and studied. Based on the past experience of die design and manufacture, CAD/CAE technology is used. The design of the gating system and exhaust system is optimized, and the design scheme of the new mold gating system and exhaust system is determined. The secondary ejection mechanism of the upper mold in the demoulding system was put forward to improve the bad phenomena such as warpage and delamination caused by the large mucosal force in the central part of the mould when the mould was separated from the plastic sealing body in the past. Finally, the mould design scheme is determined by mould and product processing test analysis, trial production and verification. From the aspect of die structure design, the problems of forming quality and stress control in EMC packaging with green epoxy moulding plastic are solved, and the quality and production efficiency of finished products are improved. The new packaging die can also expand the selection range of green epoxy moulding plastic EMC and reduce the packaging cost.
【学位授予单位】：大连理工大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN405

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