基于TFET器件模型的单元特性仿真
[Abstract]:With the rapid development of integrated circuits, the demand for low-power devices is becoming more and more serious, and the research on tunneling field effect transistors (Tunnel Field-Effect Transistor,TFET), which have the most promising prospect, is also getting deeper and deeper. The latest studies at home and abroad show that TFET process has short fabrication period and low working voltage, which is different from the traditional mode of MOSFET dependent carrier drift diffusion to generate current through quantum tunneling effect. This unique device structure makes the static power consumption of TFET very small, which indicates that TFET has a large application market in the field of low-power devices. The aim of this paper is to complete the simulation of cell characteristics based on TFET device model. After comparing the electrical properties and conductive mechanism between TFET and traditional MOSFET, the TFET device model of III-V heterojunction semiconductor compound structure under 20 nm process is selected, and the standard cell based on the TFET model is simulated. The simulation objects include inverter, non-gate, or non-gate and dynamic D flip-flop. The simulation parameters include propagation delay, output transmission time, short-circuit energy consumption and static power consumption. The results show that the propagation delay of a single input of the complex logic gate is the same as that of a TFET basic inverter, which is consistent with the theory of logic effort. The time series parameters of D flip-flop are measured. The results show that the dynamic D flip-flop has minimal establishment, holding time and high circuit performance. At the same time, three kinds of static memory based on the TFET device model are simulated. The simulation includes read noise tolerance and write noise tolerance. The read noise tolerance and write noise tolerance of the first and second TFET static memory are not ideal. The third static memory is adjusted on the basis of the first two, and the read noise tolerance is 128.1 MV. The write noise tolerance is 55.3 MV, which meets the requirements of the static memory read stability and write stability. The simulation results demonstrate the feasibility of replacing the traditional MOSFET cells with TFET cells in the static memory design. Because the parameters of cell characteristic simulation do not involve parasitic parameter information, this paper can be regarded as the basic research of TFET device model, which provides a certain reference value for the following TFET device to replace the traditional MOSFET device technology research direction.
【学位授予单位】:哈尔滨工业大学
【学位级别】:硕士
【学位授予年份】:2015
【分类号】:TN386
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