面向片式元件编带的热封装置设计与实现

发布时间：2019-01-18 07:35

【摘要】：SMT(表面贴装技术)产品与系统的广泛应用,使得片式元件的种类日趋繁多,编带的热封质量在一定程度上影响元件存储、转运及封装的使用性能,提高片式元件编带热封装置的适应性和热封质量具有重大意义。本文重点提出了一种适应性和热封质量较好的热封装置,并通过了仿真分析和实验论证。具体研究工作如下:首先,提出了一种两侧热封刀间距可调的热封装置,进而结合设计指标和实际工况提出相应的温控方案和压力控制方案,其温度控制精度达到±1°C。其次,稳态和瞬态热分析结果表明:本文设计的热封装置的热封刀工作表面温度分布均匀,热封刀达到目标温度稳态时所需的时间具有实际生产指导作用,依据分析结果对热封模块结构进行了优化设计,使得热封刀工作表面温度更为精确,装置的隔热效果得到较大的改善。最后,实现并验证了本设计方案热封装置满足设计需求。根据热封质量的评定标准,对热封装置得到的二次热封的料带成品进行揭膜拉力实验和表面轮廓观测实验,验证了该热封装置的可行性以及料带二次热封的可行性,同时确定了不同材料料带二次热封的较优热封工艺参数组合,并根据实验结果对热封刀宽进行优化设计,增加热封刀调平功能,实现了更好的热封效果。总之,本文所设计的热封装置方案已经获得实际测试验证,并已经投入实际生产应用,能够广泛适应片式元件的热封要求,具有良好的热封效果,并可推广应用于类似生产工艺与系统。
[Abstract]:With the wide application of SMT (Surface Mount Technology) products and systems, there are more and more kinds of chip components. The heat sealing quality of braiding affects the storage, transfer and packaging performance of components to a certain extent. It is of great significance to improve the adaptability and quality of hot sealing device. In this paper, a kind of heat sealing device with good adaptability and heat sealing quality is put forward, and the simulation analysis and experimental demonstration are carried out. The specific research work is as follows: firstly, a heat sealing device with adjustable gap between two sides of the heat seal knife is proposed, and then the corresponding temperature control scheme and pressure control scheme are put forward in combination with the design index and the actual working conditions. The temperature control accuracy reaches 卤1 掳C. Secondly, the results of steady-state and transient thermal analysis show that the working surface temperature distribution of the heat seal knife designed in this paper is uniform, and the time required to achieve the steady state of the heat seal knife has practical production guidance function. According to the analysis results, the structure of the heat seal module is optimized, which makes the working surface temperature of the heat seal knife more accurate, and the heat insulation effect of the device is improved greatly. Finally, the design scheme is realized and verified that the heat sealing device meets the design requirements. According to the evaluation standard of heat seal quality, the film pulling force test and surface profile observation experiment of the finished product of the secondary heat seal obtained by the heat seal device are carried out. The feasibility of the heat sealing device and the feasibility of the secondary heat seal of the material belt are verified. At the same time, the optimum technological parameters of secondary heat seal with different materials were determined, and according to the experimental results, the width of heat sealing tool was optimized, and the flattening function of heat seal knife was added to achieve better heat sealing effect. In a word, the scheme of heat sealing device designed in this paper has been tested and verified in practice, and has been put into practical production. It can widely meet the requirements of heat sealing of chip elements, and has good heat sealing effect. It can be popularized and applied to similar production processes and systems.
【学位授予单位】：华中科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN05

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