集成电路封装用绝缘胶漏电失效分析
发布时间：2019-01-21 16:51
【摘要】：在电子元器件封装领域中,塑封器件正逐步替代气密性封装器件。目前工业级塑封器件已不能满足器件的高可靠性要求,工业级塑封器件在严酷的环境应力试验中经常出现失效。研究了工业级塑封器件在可靠性筛选试验中出现失效的问题,通过X射线观察和芯片切面分析等方法,查明了造成器件失效的原因,并提出了优化改进措施。
[Abstract]:In the field of electronic components packaging, plastic packaging devices are gradually replacing airtight packaging devices. At present, the industrial plastic sealing device can not meet the high reliability requirements of the device, and the industrial plastic sealing device often fails in the severe environmental stress test. The failure of industrial plastic sealing devices in reliability screening tests was studied. By means of X-ray observation and chip section analysis, the causes of device failure were found out, and the optimization and improvement measures were put forward.
【作者单位】： 中国电子科技集团公司第二十四研究所;
【分类号】：TN405
本文编号：2412832
[Abstract]:In the field of electronic components packaging, plastic packaging devices are gradually replacing airtight packaging devices. At present, the industrial plastic sealing device can not meet the high reliability requirements of the device, and the industrial plastic sealing device often fails in the severe environmental stress test. The failure of industrial plastic sealing devices in reliability screening tests was studied. By means of X-ray observation and chip section analysis, the causes of device failure were found out, and the optimization and improvement measures were put forward.
【作者单位】： 中国电子科技集团公司第二十四研究所;
【分类号】：TN405
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