多孔微热沉大功率LED阵列传热仿真与实验研究
发布时间：2019-02-23 11:14
【摘要】：LED(Light Emitting Diode)由于其相对普通照明技术的诸多优点而被广泛使用。然而,由于LED芯片电光转换效率低,在工作状态中有约80%-90%的电能转换为了热量,热量的聚集将对LED的工作状态产生许多不良影响。所以,散热问题成为了当下急需解决的LED发展应用的难题之一。针对LED的散热问题,综述了近年来研究LED散热的相关文献,主要分析了关于LED的主动散热的诸多方式,并进行相互优缺点比较,采用了适合大功率LED阵列的散热方法——水冷式多孔微热沉。主要研究内容如下:第一,搭建实验台架对多孔微热沉LED阵列的传热效果进行研究,多孔芯采用铜丝制作,多孔微热沉LED阵列采用5×5的芯片布置方式。研究表明,在输入功率为45W和75W时温度测量点T3的实验温度分别为38.3℃和45.4℃。第二,对实验所用多孔微热沉进行建模仿真,并将实验结果和仿真结果进行对比,发现模拟结果与实验结果的温差在1℃以内,可为后续的研究工作提供可靠的仿真分析工具。第三,利用已验证的仿真方法探讨多孔介质的进出口数目、流速、孔隙率等对系统散热性能的影响。发现相同流量下,进出口由一进一出改为两进两出能改善系统换热;流速由0.25m/s增大至0.5m/s时,系统换热效果提升幅度最明显;孔隙率越小,散热效果越明显,但是流动阻力也随之增大;而且即使在环境温度高达36℃的情况下,系统芯片的最高温度也才45.8℃。第四,为了改善系统的换热效果,根据前文实验和仿真模拟工作,利用已验证的仿真模型,发现一种下空结构,无论是从芯片基板的温度均匀性、安装便捷性或经济性角度考虑,该结构都具有优良的特性。本文工作目的是希望能提供一些理论与实际方面的设计依据,能更好解决大功率LED阵列系统的散热难题并推动其发展与应用。
[Abstract]:LED (Light Emitting Diode) is widely used because of its advantages over ordinary lighting technology. However, because of the low efficiency of electro-optic conversion of LED chip, about 80% to 90% of the electrical energy is converted to heat in the working state. The accumulation of heat will have a lot of adverse effects on the working state of LED. Therefore, the problem of heat dissipation has become one of the most difficult problems in the development and application of LED. In view of the heat dissipation of LED, this paper summarizes the related literatures on LED heat dissipation in recent years, mainly analyzes many ways of active heat dissipation of LED, and compares the advantages and disadvantages of each other. Water cooled porous micro heat sink, which is suitable for high power LED array, is adopted. The main research contents are as follows: first, the heat transfer effect of porous micro-heat-sink LED array is studied by building an experimental bench. The porous core is made of copper wire, and the porous micro-heat-sink LED array is arranged with 5 脳 5 chips. The results show that the experimental temperature of temperature measurement point T3 is 38.3 鈩，
本文编号：2428767
[Abstract]:LED (Light Emitting Diode) is widely used because of its advantages over ordinary lighting technology. However, because of the low efficiency of electro-optic conversion of LED chip, about 80% to 90% of the electrical energy is converted to heat in the working state. The accumulation of heat will have a lot of adverse effects on the working state of LED. Therefore, the problem of heat dissipation has become one of the most difficult problems in the development and application of LED. In view of the heat dissipation of LED, this paper summarizes the related literatures on LED heat dissipation in recent years, mainly analyzes many ways of active heat dissipation of LED, and compares the advantages and disadvantages of each other. Water cooled porous micro heat sink, which is suitable for high power LED array, is adopted. The main research contents are as follows: first, the heat transfer effect of porous micro-heat-sink LED array is studied by building an experimental bench. The porous core is made of copper wire, and the porous micro-heat-sink LED array is arranged with 5 脳 5 chips. The results show that the experimental temperature of temperature measurement point T3 is 38.3 鈩，
本文编号：2428767
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