基于电磁驱动的倒装机键合装置设计

发布时间：2019-02-24 18:52

【摘要】：国家安全受空前关注,和信息安全相关的芯片产业已提升至国家战略高度,集成电路国产化率提升迫在眉睫,芯片国产化的大趋势已经不可逆转。半导体封装设备是我国集成电路产业发展的基础。我国先进设备技术目前总体处于落后状态。半导体后道封装设备中装片机要求有高速、高加速、高精度定位系统性能。键合装置是高密度倒装机的关键模块,承担半导体设备对芯片的拾取和放置,倒装芯片键合还需要在高速贴片过程中实现软着陆,达到键合装置能够提供“刚柔并济”的压力给芯片。基于电磁驱动原理的键合头具有高速高精度运动控制的良好特性,在引线键合机、粘片机、晶圆的取放以及元件检测等多种半导体封装设备中得到广泛使用。本文将以中国电子科技集团第四十五研究所研制的高密度倒装机(科技部02专项)为依托,设计了一种新型高密度倒装机的键合装置,该装置能实现拾放芯片、柔性压力控制以及响应快等功能。采用传统磁路法和有限元电磁仿真技术,对键合装置电磁场进行了深入分析,可视化显示了磁场的分布、气隙磁密大小以及磁饱和等,对装置的优化设计提供理论基础。电磁机构工作过程中会产生大量的热,对装置的温度场进行了三维温度场仿真,给出了温度场分布,并对不同功率时的温度场进行了参数化分析,对装置的热分析提供了理论支持。这对我国深入掌握倒装键合工艺的关键技术、缩短与国外设备的技术差距、提高我国封装设备的市场核心竞争力以及推动我国先进微电子封装技术的快速发展都有重要的战略意义和经济价值。
[Abstract]:The national security has been paid more attention than ever. The chip industry related to information security has been promoted to the national strategic height. It is urgent to increase the localization rate of integrated circuits, and the major trend of the localization of chips has become irreversible. Semiconductor packaging equipment is the basis of the development of integrated circuit industry in China. At present, China's advanced equipment and technology are in a state of backwardness. High-speed, high-precision positioning system is required in semiconductor rear-channel packaging equipment. The bonding device is the key module of the high density reverse loader, which is responsible for picking up and placing the chip by semiconductor equipment, and the chip bonding also needs to achieve soft landing in the process of high speed patch. Reach bonding device can provide "hard and soft" pressure to the chip. The bonding head based on electromagnetic driving principle has good characteristics of high speed and high precision motion control. It is widely used in many kinds of semiconductor packaging equipment such as lead bonding machine, wafer tapping and component detection and so on. In this paper, a new type of bonding device for high density reverse loader is designed based on the high density flip machine developed by the 45 Research Institute of China Electronic Science and Technology Group (Ministry of Science and Technology). The device can realize picking up and placing chip. Flexible pressure control and fast response functions. By using the traditional magnetic circuit method and finite element electromagnetic simulation technology, the electromagnetic field of the bonding device is analyzed in depth. The distribution of magnetic field, the density of air gap and the magnetic saturation are visualized, which provides a theoretical basis for the optimal design of the device. A large amount of heat will be produced in the working process of the electromagnetic mechanism. The three-dimensional temperature field of the device is simulated, the temperature field distribution is given, and the parameterized analysis of the temperature field with different power is carried out. It provides theoretical support for the thermal analysis of the device. This will help our country to master the key technology of the reverse bonding process and shorten the technical gap with foreign equipment. It is of great strategic significance and economic value to improve the market core competitiveness of packaging equipment in China and to promote the rapid development of advanced microelectronic packaging technology in China.
【学位授予单位】：北京工业大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN405

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