可延展柔性电子基底微观分析

发布时间：2019-03-25 08:29

【摘要】：可延展柔性电子产品在可穿戴电子、柔性显示和医疗等领域中具有很大的应用潜力。在可延展柔性电子的应用中,可延展柔性电子基底与互连导线之间的可靠性研究受到越来越广泛的关注。以可延展柔性电子界面为研究对象,从微观机理出发讨论可延展柔性电子界面的可靠性问题,运用分子动力学(MD)的方法建立基底的微观模型。用掺杂的方式优化基底的各项性质,以提高可延展柔性电子界面的可靠性。在聚二甲基硅氧烷(PDMS)基底中掺杂SiO_2纳米粒子后的复合物,经分子动力学仿真分析得出,基底热膨胀系数随着掺杂SiO_2原子数分数的增大而减小;杨氏模量随着掺杂SiO_2原子数分数的增大而增大。这说明加入SiO_2可以很好地提高PDMS的机械特性和降低基底的热膨胀系数,使优化后的基底更加适合与互连导线结合,提高整体的可靠性。
[Abstract]:Extendable flexible electronic products have great potential applications in wearable electronics, flexible display and medical treatment. In the application of extendable flexible electrons, more and more attention has been paid to the study of reliability between extendable flexible electronic substrates and interconnection wires. Taking the extendable flexible electronic interface as the research object, the reliability of the extendable flexible electronic interface is discussed on the basis of the micro-mechanism, and the micro-model of the substrate is established by using the method of molecular dynamics (MD). The properties of the substrate are optimized by doping to improve the reliability of the extendable flexible electronic interface. The composite doped with SiO_2 nanoparticles in polydimethylsiloxane (PDMS) substrate was analyzed by molecular dynamics simulation, and the thermal expansion coefficient of the substrate decreased with the increase of the number of doped SiO_2 atoms. The Young's modulus increases with the increase of the atomic fraction of doped SiO_2. This shows that the addition of SiO_2 can improve the mechanical properties of PDMS and decrease the coefficient of thermal expansion of the substrate, which makes the optimized substrate more suitable for the combination of interconnect wires and improves the overall reliability.
【作者单位】：桂林电子科技大学机电工程学院;
【基金】：国家自然科学基金资助项目(61474032)
【分类号】：TN601

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