印制电路板合拼排样优化方法研究与应用

发布时间：2019-03-28 12:53

【摘要】：当前,随着计算机、电子、通信等高科技产业的高速发展,印制电路板(PCB)的需求迅猛增长,PCB合拼下料技术作为减少生产调整成本和提高生产效率的关键技术,越来越受到PCB生产厂商的重视。本文围绕着PCB合拼排样优化问题展开深入研究,主要研究内容慨括如下:首先,描述了PCB合拼排样优化问题的概念,分析了该问题与标准二维矩形排样问题的异同点,给出了数学模型,并针对PCB合拼排样优化问题的特点,设计了“分而治之”的求解思路和框架。其次,研究了PCB分组优化算法。针对PCB优化目标的特殊性,提出了一种“样板-复制”的求解策略,并采用启发式算法对PCB进行分组,保证了每组PCB能按照数量比例合拼在“样板”上,通过“复制”相同的拼板,减少最终拼板种类,并结合实例验证了该算法的有效性。然后,研究了带工艺约束的PCB排样算法。总结了PCB排样问题的约束条件,建立了相应的数学模型,根据对数学模型以及问题特殊性的分析,改进了基于NFP的最低重心放置策略,通过对PCB不同旋转角度以及不同组合姿态的NFP计算,保证了PCB在满足约束的条件下,可同时求解放置位置和姿态。本文还提出了基于适应度计算的排样算法优化PCB排样顺序,提高了获得可行解的几率,最后结合实例验证了该算法的有效性。最后,基于提出的PCB合拼排样优化算法以及企业实际需求,设计开发了PCB合拼拼板排样软件系统。从典型的应用结果来看,本文提出的PCB合拼排样优化算法与PCB传统拼板方法相比,效果比较良好,为企业降低生产成本、提高生产效率提供了技术保证。
[Abstract]:At present, with the rapid development of high-tech industries such as computer, electronics, communication and so on, the demand for printed circuit board (PCB) grows rapidly. PCB cutting-off technology is regarded as the key technology to reduce the cost of production adjustment and improve the production efficiency. More and more attention has been paid to PCB manufacturers. The main contents of this paper are as follows: firstly, the concept of PCB joint layout optimization problem is described, and the similarities and differences between this problem and the standard two-dimensional rectangular layout problem are analyzed, and the main research contents are as follows: first, the concept of PCB joint layout optimization problem is described, and the similarities and differences between this problem and the standard 2D rectangular layout problem are analyzed. The mathematical model is given, and the solution idea and frame of "divide and conquer" are designed according to the characteristics of PCB joint layout optimization problem. Secondly, the PCB grouping optimization algorithm is studied. In view of the particularity of the optimization goal of PCB, a solution strategy of "template-copy" is put forward, and the heuristic algorithm is used to group the PCB, which ensures that each group of PCB can be put together on the "template" according to the proportion of quantity. By "copying" the same splice, the final type of puzzle is reduced, and the effectiveness of the algorithm is verified by an example. Then, the PCB layout algorithm with process constraints is studied. The constraint conditions of PCB layout problem are summarized, and the corresponding mathematical model is established. According to the analysis of the mathematical model and the particularity of the problem, the lowest center of gravity placement strategy based on NFP is improved. By calculating the NFP of PCB with different rotation angles and different combined attitude, it is guaranteed that PCB can solve the placement position and attitude simultaneously under the condition of satisfying the constraints. In this paper, a scheduling algorithm based on fitness calculation is proposed to optimize the PCB layout order, which improves the probability of obtaining feasible solutions. Finally, the effectiveness of the algorithm is verified by an example. Finally, based on the proposed PCB assembly layout optimization algorithm and the actual requirements of the enterprise, a software system for PCB collage layout is designed and developed. From the typical application results, compared with the traditional PCB collage method, the optimization algorithm of PCB assembly layout proposed in this paper has a better effect, which provides a technical guarantee for enterprises to reduce production costs and improve production efficiency.
【学位授予单位】：华中科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN41

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