面向高密度封装的解耦并联调平机构控制系统设计与实现

发布时间：2019-04-01 23:21

【摘要】：随着IC芯片单位面积凸点数目的急剧增加,对封装工艺中芯片拾取、转移过程定位精度、一致性等提出了更高要求;特别在高密度封装中,芯片与基板精确平行对位所要求的芯片调平功能实现难度较高。本文以高密度倒装键合设备贴片装置的解耦并联调平机构为对象,研究其基于音圈电机驱动下的控制系统设计、运动学建模和控制策略等方面,旨在提高解耦并联调平机构的控制精度。主要研究内容如下:1、分析了解耦并联调平机构面向实际高密度封装工况对控制系统的设计需求,完成了控制系统设计和关键部件选型。2、提出了解耦并联调平机构的运动学模型,并基于Adams软件进行了仿真分析。详细解算了简化的解耦并联调平机构运动学模型包括位置、速度和加速度的数学关系,Adams软件仿真结果表明:所提解耦并联调平机构运动学模型有效,可用于控制策略的分析和设计。3、提出了一种基于解耦并联调平机构运动学模型的复合控制器,用于改善解耦并联调平机构的运动控制性能。基于Adams和Matlab的联合仿真显示:复合控制器与常规的PID控制器相比,不仅大幅降低了系统的超调量,缩短了系统的稳定时间,并在一定程度上减少了系统的跟随误差。4、通过高密度倒装键合设备对所设计的解耦并联机构控制系统和控制策略进行了实验研究,进一步验证了所设计的控制系统和复合控制器的有效性。实验结果表明:对于解耦并联调平机构的位置控制系统要求,所提出的复合控制器表现出了与仿真一致的优越性能,提高了系统的控制效果。5、最终调平精度测量结果表明:所提出的复合控制器有效的提高了解耦并联调平机构的控制精度,满足调平机构?0.01?调平精度要求。本文研究理论与成果已经成功应用于高密度倒装键合设备中,控制效果良好。所实现的解耦并联调平机构控制系统可以推广到半导体封装领域中其他需要高精定位的工况,具有较好应用前景。
[Abstract]:With the rapid increase of the number of bump points per unit area of IC chips, higher requirements for chip pick-up, transfer process positioning accuracy, consistency and so on are put forward in the packaging process. Especially in the high-density package, it is difficult to realize the chip leveling function required by the precise parallel alignment between the chip and the substrate. In this paper, the decoupling parallel leveling mechanism of high-density flip-chip bonding device is taken as the object, and the control system design, kinematics modeling and control strategy based on voice coil motor are studied, and so on. The aim of this paper is to improve the control precision of decoupling parallel leveling mechanism. The main research contents are as follows: 1. The design requirements of the control system for the actual high-density packaging condition of the decoupling parallel leveling mechanism are analyzed, and the design of the control system and the selection of the key components are completed. The kinematics model of decoupling parallel leveling mechanism is proposed, and the simulation analysis is carried out based on Adams software. The simplified kinematics model of decoupled parallel leveling mechanism is solved in detail, including the mathematical relationship among position, velocity and acceleration. The simulation results of Adams software show that the proposed kinematic model of decoupled parallel leveling mechanism is effective. It can be used in the analysis and design of control strategy. 3. A compound controller based on the kinematics model of decoupled parallel leveling mechanism is proposed to improve the motion control performance of decoupled parallel leveling mechanism. The combined simulation based on Adams and Matlab shows that compared with the conventional PID controller, the compound controller not only greatly reduces the overshoot of the system, shortens the stability time of the system, but also reduces the following error of the system to a certain extent. The control system and control strategy of the decoupled parallel mechanism are experimentally studied by using high density flip-chip bonding equipment, and the effectiveness of the designed control system and compound controller is further verified. The experimental results show that for the position control system requirements of decoupled parallel leveling mechanism, the proposed compound controller shows superior performance consistent with the simulation and improves the control effect of the system. The final leveling accuracy measurement results show that the proposed compound controller can effectively improve the control accuracy of the decoupling parallel leveling mechanism, and meet the requirements of the leveling mechanism-0.01? Leveling accuracy requirements. The theory and achievements of this paper have been successfully applied in high-density flip-chip bonding equipment, and the control effect is good. The control system of decoupled parallel leveling mechanism can be extended to other conditions which require high precision positioning in semiconductor packaging field, and has a good application prospect.
【学位授予单位】：华中科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN405

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