基于Genesis软件的特性阻抗板的设计与实现
发布时间：2019-04-27 15:50
【摘要】：印制电路板(Printed Circuit Board,PCB)的特性阻抗必须与头尾元件的电子阻抗匹配才能保证PCB信号传输的完整性。本文主要从PCB设计与制作的角度提出解决其阻抗匹配的方法。从设计理论的角度分析了影响阻抗板控制的各种因素,同时对线宽、线路铜厚、介电层厚度、相对介电常数等影响因素,进行了进一步分析,提出了各个因素的一般执行标准,确认了重点影响因素,为计算阻抗值提供了依据。再者通过介绍高频电路理论,传输线理论和阻抗产生原因和影响等,总结了如何解决系统设计过程因为阻抗的影响而出现的问题,为设计阶段提供了可靠的理论基础。应用Protel99se软件,在CAD(Computer Aided Design,计算机辅助设计)设计阶段,研究了阻抗PCB的设计流程和设计重点,分别讨论了如何按照设计流程来实现阻抗板的设计以及在设计过程中如何把握设计规则,约束设计条件。然后在布局过程中引进了工程约束规则,探讨了在整个阻抗PCB设计过程中的一些经验和技巧,加快了布局问题的求解,并按实际的约束条件和经验布局布线。在分析了各模块原理的基础上,完成了电路原理图和整个系统的PCB设计。基于Genesi2000软件设计出了高频PCB的CAM(Computer Aided Manufacture,计算机辅助制造)作业流程,设计制作出了符合客户要求并在工厂制程能力范围内的PCB照相底片资料和钻孔资料,最后并针对Genesis2000软件在制作工程资料过程中较为繁琐的工作,使用C Shell语言在Window7环境下设计开发出符合阻抗板工程设计的阻抗条自动化脚本。基于Genesi2000软件研究了如何实现阻抗PCB的工艺。对现有公司的不良产品进行分析,对电镀均匀性、人为和设备因素进行了改善,如对垂直连续电镀线(Vertical Continuous Plating,VCP)更换夹具夹板方式、改换大V型座、更改电镀槽钛篮尺寸及形状等.针对蚀刻不均匀的原因进行DOE(Design Of Experiments,试验设计)分析,得到蚀刻均匀性的最佳参数组合为:采用酸槽速度2.2~3.1m/min,酸液浓度4.5~5.5mol/L,溶液温度45±5℃,蚀刻喷压0.1~0.2Mpa。紧接着采用改善后工艺,严格遵守各工序要求,完成了阻抗PCB的制作,未发现有品质问题,并且完成阻抗测试。后续研究该着重推广阻抗PCB设计阶段的改善以及工艺的改善,达到批量化的应用。
[Abstract]:The characteristic impedance of printed circuit board (Printed Circuit Board,PCB) must match with the electronic impedance of the head and tail components in order to ensure the integrity of PCB signal transmission. In this paper, a method to solve the impedance matching of PCB is put forward from the point of view of design and fabrication. The factors that influence the control of the impedance plate are analyzed from the point of view of design theory. At the same time, the influence factors such as linewidth, copper thickness, dielectric layer thickness, relative dielectric constant and so on are further analyzed, and the general implementation standard of each factor is put forward. The key influencing factors are confirmed and the basis for calculating impedance value is provided. Furthermore, by introducing the theory of high frequency circuit, transmission line theory and the causes and effects of impedance, this paper summarizes how to solve the problems caused by the impedance in the design process of the system, which provides a reliable theoretical basis for the design stage. In the design phase of CAD (Computer Aided Design, (computer aided Design), using Protel99se software, the design flow and key points of impedance PCB are studied. This paper discusses how to realize the design of the impedance plate according to the design flow and how to grasp the design rules and restrict the design conditions in the design process. Then the engineering constraint rules are introduced in the layout process, some experiences and skills in the whole impedance PCB design process are discussed, and the solution of the layout problem is speeded up, and the layout is arranged according to the actual constraint conditions and experience. On the basis of analyzing the principle of each module, the circuit schematic diagram and the PCB design of the whole system are completed. Based on Genesi2000 software, the CAM (Computer Aided Manufacture, computer aided manufacturing (CAM (Computer Aided Manufacture,) operation flow of high frequency PCB is designed, and the PCB photographic film data and drilling hole data which accord with the customer's requirements and within the scope of the factory process ability are designed and produced. Finally, in view of the tedious work of Genesis2000 software in making engineering data, the impedance bar automation script is designed and developed by using C-Shell language in the environment of Window7, which accords with the engineering design of impedance plate. Based on Genesi2000 software, how to realize the process of impedance PCB is studied. This paper analyzes the bad products of the existing company, improves the uniformity of electroplating, man-made and equipment factors, such as changing clamp splint mode of vertical continuous plating line (Vertical Continuous Plating,VCP) and changing large V-type seat. Change the size and shape of plating bath titanium basket. According to the reason of non-uniform etching, the DOE (Design Of Experiments, test design was carried out, and the optimum parameters of etching uniformity were obtained as follows: acid groove velocity 2.2 ~ 3.1mmin, acid concentration 4.5 ~ 5.5 mol / L, solution temperature 45 卤5 鈩，
本文编号：2467104
[Abstract]:The characteristic impedance of printed circuit board (Printed Circuit Board,PCB) must match with the electronic impedance of the head and tail components in order to ensure the integrity of PCB signal transmission. In this paper, a method to solve the impedance matching of PCB is put forward from the point of view of design and fabrication. The factors that influence the control of the impedance plate are analyzed from the point of view of design theory. At the same time, the influence factors such as linewidth, copper thickness, dielectric layer thickness, relative dielectric constant and so on are further analyzed, and the general implementation standard of each factor is put forward. The key influencing factors are confirmed and the basis for calculating impedance value is provided. Furthermore, by introducing the theory of high frequency circuit, transmission line theory and the causes and effects of impedance, this paper summarizes how to solve the problems caused by the impedance in the design process of the system, which provides a reliable theoretical basis for the design stage. In the design phase of CAD (Computer Aided Design, (computer aided Design), using Protel99se software, the design flow and key points of impedance PCB are studied. This paper discusses how to realize the design of the impedance plate according to the design flow and how to grasp the design rules and restrict the design conditions in the design process. Then the engineering constraint rules are introduced in the layout process, some experiences and skills in the whole impedance PCB design process are discussed, and the solution of the layout problem is speeded up, and the layout is arranged according to the actual constraint conditions and experience. On the basis of analyzing the principle of each module, the circuit schematic diagram and the PCB design of the whole system are completed. Based on Genesi2000 software, the CAM (Computer Aided Manufacture, computer aided manufacturing (CAM (Computer Aided Manufacture,) operation flow of high frequency PCB is designed, and the PCB photographic film data and drilling hole data which accord with the customer's requirements and within the scope of the factory process ability are designed and produced. Finally, in view of the tedious work of Genesis2000 software in making engineering data, the impedance bar automation script is designed and developed by using C-Shell language in the environment of Window7, which accords with the engineering design of impedance plate. Based on Genesi2000 software, how to realize the process of impedance PCB is studied. This paper analyzes the bad products of the existing company, improves the uniformity of electroplating, man-made and equipment factors, such as changing clamp splint mode of vertical continuous plating line (Vertical Continuous Plating,VCP) and changing large V-type seat. Change the size and shape of plating bath titanium basket. According to the reason of non-uniform etching, the DOE (Design Of Experiments, test design was carried out, and the optimum parameters of etching uniformity were obtained as follows: acid groove velocity 2.2 ~ 3.1mmin, acid concentration 4.5 ~ 5.5 mol / L, solution temperature 45 卤5 鈩，
本文编号：2467104
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