某密闭式通信电子设备的结构热设计研究
发布时间：2019-05-10 02:28
【摘要】：现代电子产品功能多、体积小、结构紧凑,使得电子设备在有限的体积范围内,功率密度不断增加,热流密度迅速提高,导致电子设备的工作温度急剧上升,故障发生率也越来越频繁。因此,为保证电子设备在相应的工作环境下,长期、可靠、稳定工作,热设计是必须要考虑的关键点之一。本文以某军用密闭式通信电子设备机箱散热器的热设计为例,使用Ansys热分析软件中的Icepak模块进行建模并求解,得出其分别在20℃、30℃、60℃等恶劣环境条件下的温度分布情况;利用正交试验的分析方法得到了影响设备散热的主次要因素,并通过对多种优化结构模型的热分析,确定了散热器翅片结构尺寸的最优方案;通过对工程样机的温度场实际测试进一步验证热设计的正确性。综上所述,通过热分析软件来模拟设备内部温度场的分布情况,有效缩短了研制周期,在保证设备能够正常、稳定、可靠使用的前提下,对降低生产成本有一定帮助。
[Abstract]:The modern electronic products have many functions, small size and compact structure, which make the electronic equipment in the limited volume range, the power density increases constantly, the heat flux density increases rapidly, which leads to the sharp rise of the working temperature of the electronic equipment. The incidence of faults is also becoming more and more frequent. Therefore, in order to ensure the long-term, reliable and stable work of electronic equipment in the corresponding working environment, thermal design is one of the key points that must be considered. Taking the thermal design of a military closed communication electronic equipment case radiator as an example, this paper uses the Icepak module of Ansys thermal analysis software to model and solve the heat sink, and it is obtained that the heat sink is at 20 鈩，
本文编号：2473274
[Abstract]:The modern electronic products have many functions, small size and compact structure, which make the electronic equipment in the limited volume range, the power density increases constantly, the heat flux density increases rapidly, which leads to the sharp rise of the working temperature of the electronic equipment. The incidence of faults is also becoming more and more frequent. Therefore, in order to ensure the long-term, reliable and stable work of electronic equipment in the corresponding working environment, thermal design is one of the key points that must be considered. Taking the thermal design of a military closed communication electronic equipment case radiator as an example, this paper uses the Icepak module of Ansys thermal analysis software to model and solve the heat sink, and it is obtained that the heat sink is at 20 鈩，
本文编号：2473274
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