三维封装铜柱应力及结构优化分析

发布时间：2019-05-15 02:38

【摘要】：文中利用有限元模拟软件ANSYS对三维立体封装芯片发热过程中整体应力及局部铜柱的应力情况进行了分析,并对三维封装的结构进行了优化设计.结果表明,最大应力分布在铜柱层,铜柱的应力最大点出现在铜柱外侧拐角与底部接触位置.以铜柱处最大应力作为响应,进行了结构参数优化,采用三因素三水平正交试验方法,分别使用铜柱直径、铜柱高度、铜柱间距三个影响因素作为变化的结构参数.结果表明,铜柱直径的变化对等效应力影响最大,铜柱间距次之,铜柱高度影响最小.且发现随着铜柱高度、铜柱间距、铜柱直径的不断增大其铜柱外侧拐角与底部接触位置的最大等效应力不断减小.
[Abstract]:In this paper, the finite element simulation software ANSYS is used to analyze the overall stress and the stress of local copper column in the heating process of 3D packaging chip, and the structure of 3D package is optimized. The results show that the maximum stress is distributed in the copper column layer, and the maximum stress point of the copper column appears at the contact position between the outside corner and the bottom of the copper column. In response to the maximum stress at the copper column, the structural parameters were optimized. Three factors affecting the diameter of the copper column, the height of the copper column and the spacing of the copper column were used as the structural parameters by using the orthogonal test method of three factors and three levels. The results show that the variation of copper column diameter has the greatest effect on equivalent stress, followed by copper column spacing and copper column height. It is found that the maximum equivalent stress between the outer corner and the bottom of the copper column decreases with the increase of the height of the copper column, the distance between the copper columns and the diameter of the copper column.
【作者单位】：哈尔滨理工大学材料科学与工程学院;
【基金】：黑龙江省自然科学基金资助项目(E201449)
【分类号】：TN405

【相似文献】