贴片机的力学分析与结构优化
发布时间：2019-05-20 05:39
【摘要】：伴随着微电子技术的快速发展，集成电路芯片逐渐向深亚微米方向发展，电子元器件的微型化和高功能化使得封装变得要求更高，这些都给SMT领域带来了不小的挑战。SMT的核心设备是贴片机，也正朝着多功能、高速度、高精度方向发展，贴片机是一个集机械、光学、电学等多学科于一体的产品，主要由机械系统、视觉系统和控制系统组成，本课题主要研究贴片机的机械系统，包括框架结构和运动系统。对于贴片机而言，贴装速度和精度的高要求使得机械结构的性能变得至关重要。 本论文利用ADAMS软件为工具建立虚拟样机模型，通过理想模型和原模型的仿真结果对比来分析各个因素对贴装头的动态精度影响，并根据结论找到提高贴装头定位精度的方法。 利用有限元分析软件对重要构件进行静力学分析，，通过计算和得出的应力云图、位移云图找出构架中应力集中和易变形的位置，然后通过改良设计来提高机械系统的静刚度。 利用有限元分析软件对主要构件以及整机简化系统进行模态分析，对比固有频率和振型图，对其进行结构改进使其固有频率远离驱动频率来避免共振的出现，同时对跨度大，易变形的构件进行刚度提高改进，具体措施本文也提到了一些，来实现贴片机整机的动态特性优化。 本论文的研究对象是自主研发的一台高档贴片机，通过动态分析和结构优化，样机的精度和速度已经基本达到10000片/小时的速度和20um-50um的精度设计目标。
[Abstract]:With the rapid development of microelectronics technology, integrated circuit chips are gradually developing in the direction of deep submicron. The miniaturization and high functionalization of electronic components make packaging more demanding. These bring a lot of challenges to the field of SMT. SMT's core equipment is placement machine, which is also developing in the direction of multi-function, high speed and high precision. SMT is a multi-disciplinary product, such as machinery, optics, electricity and so on. It is mainly composed of mechanical system, visual system and control system. This paper mainly studies the mechanical system of placement machine, including frame structure and motion system. For the placement machine, the high requirements of mounting speed and accuracy make the performance of the mechanical structure become very important. In this paper, the virtual prototype model is established by using ADAMS software as a tool, and the influence of each factor on the dynamic accuracy of the mounting head is analyzed by comparing the simulation results of the ideal model with the original model, and the method to improve the positioning accuracy of the mounting head is found according to the conclusion. The static analysis of important components is carried out by using finite element analysis software. The position of stress concentration and easy deformation in the frame is found out by calculating and obtaining stress cloud diagram and displacement cloud diagram, and then the static stiffness of mechanical system is improved by improved design. The modal analysis of the main components and the simplified system of the whole machine is carried out by using the finite element analysis software. The natural frequency and vibration mode diagram are compared, and the structure is improved so that the natural frequency is far away from the driving frequency to avoid the occurrence of resonance, and at the same time, the span is long. The stiffness of the easily deformed members is improved, and some concrete measures are also mentioned in this paper to optimize the dynamic characteristics of the patch machine. The research object of this paper is a high-grade placement machine developed by ourselves. through dynamic analysis and structure optimization, the accuracy and speed of the prototype have basically reached the speed of 10000 chips per hour and the precision design goal of 20um-50um.
【学位授予单位】：吉林大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN405
本文编号：2481397
[Abstract]:With the rapid development of microelectronics technology, integrated circuit chips are gradually developing in the direction of deep submicron. The miniaturization and high functionalization of electronic components make packaging more demanding. These bring a lot of challenges to the field of SMT. SMT's core equipment is placement machine, which is also developing in the direction of multi-function, high speed and high precision. SMT is a multi-disciplinary product, such as machinery, optics, electricity and so on. It is mainly composed of mechanical system, visual system and control system. This paper mainly studies the mechanical system of placement machine, including frame structure and motion system. For the placement machine, the high requirements of mounting speed and accuracy make the performance of the mechanical structure become very important. In this paper, the virtual prototype model is established by using ADAMS software as a tool, and the influence of each factor on the dynamic accuracy of the mounting head is analyzed by comparing the simulation results of the ideal model with the original model, and the method to improve the positioning accuracy of the mounting head is found according to the conclusion. The static analysis of important components is carried out by using finite element analysis software. The position of stress concentration and easy deformation in the frame is found out by calculating and obtaining stress cloud diagram and displacement cloud diagram, and then the static stiffness of mechanical system is improved by improved design. The modal analysis of the main components and the simplified system of the whole machine is carried out by using the finite element analysis software. The natural frequency and vibration mode diagram are compared, and the structure is improved so that the natural frequency is far away from the driving frequency to avoid the occurrence of resonance, and at the same time, the span is long. The stiffness of the easily deformed members is improved, and some concrete measures are also mentioned in this paper to optimize the dynamic characteristics of the patch machine. The research object of this paper is a high-grade placement machine developed by ourselves. through dynamic analysis and structure optimization, the accuracy and speed of the prototype have basically reached the speed of 10000 chips per hour and the precision design goal of 20um-50um.
【学位授予单位】：吉林大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN405
【参考文献】
相关期刊论文 前1条
1 王成,王效岳;虚拟样机技术及ADAMS[J];机械工程与自动化;2004年06期
本文编号：2481397
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