前驱物裂解法低温制备碳化硅陶瓷膜

发布时间：2018-02-04 14:22

  本文关键词： 碳化硅 聚碳硅烷 孔径分布　出处：《硅酸盐通报》2017年09期 　论文类型：期刊论文

【摘要】：将碳化硅(SiC)粉体和一定量聚碳硅烷(polycarbosilane,PCS)、蒸馏水、聚丙烯酰胺(polyacrylamide,PAM)、聚丙烯酸(polypropylene acid,PAA)混合球磨以制备水性SiC浆料并测定了SiC粒子的动电位及粘度;将浆料均匀涂在SiC支撑体上,在1100℃真空条件下烧成,制备了SiC陶瓷膜并测定陶瓷膜的孔径分布及纯水通量及观察其形貌。研究结果表明:涂膜所用的浆料在pH值为11左右时,SiC粒子动电位最大达到-40 m V,浆料表观粘度最小为20 m Pa·s,制备的陶瓷膜孔径大小集中在1μm左右,纯水通量达40 m3/(m2·h)。
[Abstract]:Sic powder and a certain amount of polycarbosilane polycarbosilane PCS, distilled water, polyacrylamide polyacrylamide polyacrylamide were prepared. SiC slurry was prepared by ball milling, and the dynamic potential and viscosity of SiC particles were measured. The slurry was evenly coated on the SiC support and sintered at 1100 鈩，

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