电沉积Cu-Ni-Sn工艺的研究

发布时间：2018-02-09 22:45

本文关键词： Cu-Ni-Sn 电沉积合金　出处：《电镀与环保》2017年01期 　论文类型：期刊论文

【摘要】：对电沉积Cu-Ni-Sn工艺进行了研究,并确定了最佳的工艺配方。研究了镀液的电流效率、分散能力、覆盖能力及镀层的结合力等性能。结果表明:该工艺操作简单方便,有望成为一种制备Cu-Ni-Sn合金的新方法。
[Abstract]:The electrodeposition Cu-Ni-Sn process was studied, and the optimum process formula was determined. The current efficiency, dispersion ability, covering ability and coating adhesion of the plating solution were studied. The results showed that the process was simple and convenient. It is expected to be a new method for preparing Cu-Ni-Sn alloys.
【作者单位】：南阳理工学院生物与化学工程学院;
【分类号】：TQ153

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