亚硫酸钠无氰脉冲电镀金—铜合金研究

发布时间：2018-03-03 19:02

  本文选题：无氰电镀　切入点：金-铜合金　出处：《大连理工大学》2015年硕士论文　论文类型：学位论文

【摘要】：金及其合金镀层因其优异的物理化学性能,广泛应用于现代电子工业中,适用于制造对于电参数性能长期稳定性要求较高的零件。传统的氰化物镀金工艺,镀液具有良好的分散能力和覆盖能力、电流效率高、稳定性好,所得镀层的表面质量好。但是,传统的氰化物镀金工艺,因其选用氰化物为金的配合物,镀液毒性大,对操作工人的危害较大,同时不利于环保。因此,新型的无氰电镀工艺成为了当代电镀工作者的主要研究方向。本文通过对比研究无氰亚硫酸钠-柠檬酸铵电镀工艺和无氰亚硫酸钠-络合物α电镀工艺,综合考虑镀层和镀液的性能,最终确定无氰亚硫酸钠-络合物α工艺为主要研究对象。通过正交试验,以镀层外观、镀层硬度和镀液沉积速率为评价指标,得到无氰亚硫酸钠-络合物α电镀金-铜工艺优化配方：金10g/L,硫酸铜1g/L,无水亚硫酸钠170g/L硫酸钾80g/L,络合物a60g/L。同时,研究了不同电镀工艺参数对镀层表面质量和镀液沉积速率的影响,通过单因素试验最终确定了优选工艺参数为：电流密度0.3A/dm2、电镀温度60℃、占空比10%、脉冲频率1000Hz、镀液pH值9、搅拌速度1000r/min。无氰脉冲亚硫酸钠-络合物α电镀工艺,镀液稳定性好,覆盖能力和分散能力优异,电流效率为82.23%。所得的金-铜合金镀层结合力良好、耐蚀性好；镀层硬度为190.43Hv,远超纯金或紫铜的硬度；XRD测试结果表明,镀层由Au3Cu固溶体组成；XRF测试结果表明镀层金质量分数90.23%,铜质量分数9.77%。
[Abstract]:Gold and its alloy coatings are widely used in modern electronic industry because of their excellent physical and chemical properties. The plating bath has good dispersion and covering ability, high current efficiency, good stability and good surface quality. However, the traditional cyanide gold plating process is highly toxic because of its choice of cyanide as the gold complex. It is not only harmful to the operation workers, but also harmful to environmental protection. A new type of cyanide-free electroplating process has become the main research direction of modern electroplating workers. In this paper, the electroplating process of non-cyanide sulfite ammonium citrate electroplating and non-cyanide sodium sulfite complex 伪 electroplating process are studied. Synthetically considering the properties of coating and bath, the process of non-cyanide sodium sulfite complex 伪 was determined as the main research object. Through orthogonal test, the coating appearance, coating hardness and deposition rate of plating solution were taken as the evaluation index. The optimized formula for gold / copper plating without cyanide sulfite complex 伪: gold 10 g / L, copper sulfate 1 g / L, anhydrous sodium sulfite 170 g / L potassium sulfate 80 g / L, complex a 60 g / L. at the same time, The effects of electroplating parameters on the surface quality and deposition rate of plating bath were studied. The optimum process parameters were determined by single factor experiment: current density 0.3A / dm2, electroplating temperature 60 鈩，

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