MSA电镀锡液连续除铅方法的研究
本文选题:镀锡板 切入点:除铅 出处:《华东理工大学》2017年硕士论文 论文类型:学位论文
【摘要】:镀锡板被广泛应用在食品饮料包装,而镀锡板镀层中铅含量超标的问题威胁着人们的健康。由于电镀生产所用的原料锡锭中有铅的存在,铅与锡的电极电位十分接近,所以在电镀过程中,铅十分容易与锡一起沉积在带钢表面,造成镀锡层中的铅含量超标。目前国内外的镀锡板生产商还缺乏有效降低镀锡板镀层中铅含量的方法及研究,仅是采用低铅锡粒来生产电镀产品,该方法大幅增加生产成本,所以研究出其他有效、经济、易操作并且环保的降铅方法迫在眉睫。电镀锡工艺十分复杂,若想有效地降低镀层中的铅含量,必须找到铅的来源,并依次进行后续的除铅研究。因此,论文首先进行了镀层中的铅来源分析,通过分析确定了锡原料是铅的最主要来源,考虑到锡铅共生矿的原因,使用低铅锡原料进行电镀锡的方法既不经济也不现实。在此基础上确定了镀锡液为除铅对象,基于化学沉淀法处理含铅废水的成熟工艺,利用硫酸钡共沉淀法来降低镀液中的铅含量,并对其除铅性能进行验证。另外结合电镀实际生产工艺,考虑到镀液的循环利用,设计了镀锡液连续除铅工艺,结合化学沉淀法及沉降过程,设计并装配了镀锡液连续除铅实验装置,该装置主要包含化学反应及沉降两个主要过程,并通过此装置进行镀液除铅实验,得到了比较适合的除铅工艺参数,为生产提供数据支持。另外,利用数值模拟的方法对现场沉降罐的沉降性能进行了研究,分析了运行参数对沉降效果的影响。
[Abstract]:Tin plating plate is widely used in food and beverage packaging, and the problem of excessive lead content in tin plate coating threatens people's health. Due to the presence of lead in tin ingots used in electroplating production, the electrode potential of lead and tin is very close to that of tin. Therefore, in the electroplating process, lead is easily deposited on the steel strip surface together with tin, which results in the lead content in the tin coating exceeding the standard. At present, domestic and foreign tinplate manufacturers lack effective methods and research to reduce the lead content in the tin plating coating. Only low lead tin particles are used to produce electroplating products. This method greatly increases the production cost, so it is urgent to develop other effective, economical, easy to operate and environmentally friendly lead reduction methods. If we want to effectively reduce the lead content in the coating, we must find the source of lead, and carry on the subsequent lead removal research in turn. Therefore, the paper first carries on the lead source analysis in the coating, through the analysis has determined that the tin raw material is the most important source of lead. Considering the reason of the cogeneration of tin and lead, the method of electroplating tin with low lead tin raw material is neither economical nor practical. On the basis of this, the mature process of treating lead-containing wastewater with tin plating solution as lead removal object is determined. The barium sulfate coprecipitation method was used to reduce the lead content in the plating bath, and its lead removal performance was verified. In addition, considering the recycling of the plating bath, the continuous lead removal process of the tin plating bath was designed, combined with the actual production process of electroplating. Combined with chemical precipitation method and sedimentation process, a continuous lead removal experiment device for tin plating bath is designed and assembled. The device mainly includes two main processes of chemical reaction and sedimentation, and carries out the experiment of bath lead removal by this device. The suitable technological parameters of lead removal are obtained to provide data support for the production. In addition, the settlement performance of the on-site settling tank is studied by numerical simulation, and the influence of operation parameters on the settlement effect is analyzed.
【学位授予单位】:华东理工大学
【学位级别】:硕士
【学位授予年份】:2017
【分类号】:TQ153.13
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