银基钎料锡电镀层的界面特征分析

发布时间：2018-03-22 17:49

本文选题：银基钎料　切入点：锡电镀层　出处：《中国有色金属学报》2017年10期 　论文类型：期刊论文

【摘要】：以BAg50CuZn钎料为基体,采用硫酸盐镀液体系在其表面电镀锡,经热扩散处理制备了镀锡银钎料。借助扫描电镜、能谱分析仪、X射线衍射分析仪等手段分析银基钎料锡电镀层的表界面形貌、化学元素组成、界面物相,并对其表面和界面化学元素进行线扫描和面扫描分析。结果表明:锡电镀层结晶晶粒呈现明显的(101)、(112)结晶取向,晶体生长方式为"向上生长"+"侧向生长"混合模式;基体钎料与锡电镀层结合紧密,经热扩散处理二者之间发生了互扩散作用,形成扩散界面区。在扩散界面区,镀层中的Sn元素与钎料中的Cu、Ag元素形成了Cu_3Sn相和Ag_3Sn相。Sn元素在银基钎料锡电镀层中分布均匀、无偏析现象。电镀锡银钎料扩散界面区主要存在Ag相、Cu相、Cu Zn相、Ag_3Sn相、Cu_3Sn相,其中Ag相、Cu相、Cu Zn相来自基体钎料。银基钎料锡电镀层的结合界面是化合物型形式。
[Abstract]:Silver solder was prepared on the surface of BAg50CuZn solder with sulphate plating solution system by thermal diffusion treatment, with the aid of SEM, SEM, SEM, SEM, SEM, SEM, SEM, SEM, SEM, SEM, SEM, SEM, SEM, SEM, SEM, SEM, SEM, The surface morphology, chemical element composition, interface phase of silver based solder tin electroplating layer were analyzed by means of energy spectrum analyzer and X-ray diffraction analyzer. The surface and interface chemical elements were analyzed by line scanning and surface scanning. The results showed that the crystal grain of tin electroplating layer showed obvious crystal orientation, and the crystal growth mode was "upward growth" and "lateral growth" mixed mode. The matrix solder and tin electroplating layer are tightly bonded, and the interdiffusion between them occurs after thermal diffusion treatment, which forms the diffusion interface region, and in the diffusion interface region, The Sn element in the plating layer and the Cu-Ag element in the solder formed the Cu_3Sn phase and the Sn phase in the silver base solder tin electroplating layer, the distribution of Sn elements in the silver based tin electroplating layer was uniform and there was no segregation phenomenon. The Ag phase, Cu phase, Cu phase and Cu Zn phase were found in the diffusion interface region of the Ag phase, and the Ag phase, Cu phase, Cu phase, Cu phase and Cu phase were found to exist in the Ag phase. Among them, Ag phase, Cu phase, Cu phase, Cu Zn phase come from matrix solder, and the bonding interface of silver base solder tin electroplating layer is compound type.
【作者单位】：华北水利水电大学机械学院;哈尔滨工业大学先进焊接与连接国家重点实验室;
【基金】：国家自然科学基金资助项目(51705151) 河南省自然科学基金资助项目(162300410191) 河南省高等学校重点科研项目(17A430021) 华北水利水电大学博士基金资助项目(201704001)~~
【分类号】：TQ153

【相似文献】